SCHEMBL10690966

SCHEMBL10690966

C=C(O)C(=O)Nc1ccc(N)cc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.59
RAB9A P51151 3/20 0.59
MEN1 O00255 3/20 0.53
KMT2A Q03164 3/20 0.53
TDP1 Q9NUW8 2/20 0.53
PKM P14618 2/20 0.53
LMNA P02545 2/20 0.53
POLB P06746 1/20 0.53
APEX1 P27695 1/20 0.53
GAA P10253 3/20 0.47
GFER P55789 2/20 0.47
KDM4E B2RXH2 1/20 0.47
GLA P06280 1/20 0.47
THRB P10828 1/20 0.47
BLM P54132 1/20 0.47
CASP6 P55212 1/20 0.47
ALDH1A1 P00352 1/20 0.47
MAPK1 P28482 1/20 0.47
CA12 O43570 2/20 0.46
CA1 P00915 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1967951 0.83 MAPT (0.64) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL9812574 0.83 GAA (0.61) MAPTRAB9AMEN1KMT2ALMNA
SCHEMBL9337050 0.82 MAPT (0.57) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL3298240 0.82 RXFP1 (0.62) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL1772808 0.80 SMN1; SMN2 (0.58) MAPTRAB9AMEN1KMT2APKM
Hydrochloric Acid SCHEMBL6673965 0.80 RXFP1 (0.61) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL13881515 0.79 KIF11 (0.54) RAB9AMEN1KMT2ALMNAPOLB
SCHEMBL3038302 0.78 MAPT (0.70) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL2495334 0.78 PTPN11 (0.71) MAPTRAB9AMEN1KMT2ATDP1
SCHEMBL6292762 0.77 MAPT (0.52) MAPTRAB9AMEN1KMT2ATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-1988005791-A1 RADIATION-CURED ADHESIVE SYSTEM CONTAINING AMIDES DYMAX CORPORATION (US) 1988-08-11 WO claimed
WO-1988005791-A1 RADIATION-CURED ADHESIVE SYSTEM CONTAINING AMIDES DYMAX CORPORATION (US) 1988-08-11 WO disclosed