SCHEMBL1077804

SCHEMBL1077804

O=C(O)CC(=S)C(C(=S)CC(=O)O)(C(=S)CC(=O)O)C(CO)(CO)CCO

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
LDHA P00338 1/20 0.31
SRR Q9GZT4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6081467 0.73 ARG1 (0.31)
SCHEMBL2477881 0.69 LDHA (0.32) LDHASRR
SCHEMBL540504 0.67 ALDH1A1 (0.35)
SCHEMBL11171269 0.67 ALDH1A1 (0.32)
SCHEMBL9302940 0.65 MGAM (0.30)
Glycolic Acid SCHEMBL3678490 0.64
Glycine SCHEMBL11545564 0.61 GLRA1 (0.42)
Acrylic Acid SCHEMBL7634451 0.61 LMNA (0.42)
SCHEMBL300329 0.61 CYP2D6 (0.33)
SCHEMBL119386 0.61 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0942028-B1 Epoxy resin composition AJINOMOTO KK (JP) 2004-11-24 EP claimed
EP-0289852-B1 RADIATION CURABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION Hitachi Chemical Co., Ltd. (JP) 1992-07-29 EP claimed
JP-5142501-A None JP disclosed
JP-3297638-A None JP disclosed
EP-3521364-B1 COPOLYMER COMPOSITION HAVING PHOSPHONATE GROUP KURARAY CO (JP) 2021-12-15 EP disclosed
US-10597543-B2 Method for repairing or reinforcing structure, method for producing repaired or reinforced structure, and adhesive sheet DAI NIPPON PRINTING CO., LTD. (JP) 2020-03-24 US disclosed
EP-2957579-B1 COPOLYMER AND MOLDED BODY KURARAY CO (JP) 2019-10-02 EP disclosed
EP-3521364-A1 COPOLYMER COMPOSITION HAVING PHOSPHONATE GROUP Kuraray Co., Ltd. (JP) 2019-08-07 EP disclosed
US-10287380-B2 Copolymer, and molded article KURARAY CO., LTD. (JP) 2019-05-14 US disclosed
EP-3145723-B1 LIQUID JET HEAD AND METHOD FOR PRODUCING SAME, AND LIQUID JET APPARATUS AND IMAGE FORMING APPARATUS RICOH CO LTD (JP) 2018-09-05 EP disclosed
US-9856342-B2 Copolymer and molded body KURARAY CO., LTD. (JP) 2018-01-02 US disclosed
US-20030134926-A1 (Meth) acryloyl group-containing compound and method for producing the same NIPPON SHOKUBAI CO., LTD. 2003-07-17 US disclosed
US-20030118941-A1 Photocurable composition, cured product and process for producing the same MITSUBISHI CHEMICAL CORPORATION (JP) 2003-06-26 US disclosed
EP-1275668-A1 PHOTOCURABLE COMPOSITION, CURED OBJECT, AND PROCESS FOR PRODUCING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2003-01-15 EP disclosed
EP-1157074-A1 A METHOD FOR THE ADHESION OF VINYLIDENE FLUORIDE RESINS TO METAL SUBSTRATES, AND AN ELECTRODE STRUCTURE AND ITS METHOD OF PRODUCTION ELF ATOCHEM S.A. (FR) 2001-11-28 EP disclosed
US-6191229-B1 REACTING A REACTION MIXTURE RESULTING FROM A POLYMERIZATION REACTION OF A MONOMER COMPONENT INCLUDING (METH)ACRYLIC ESTER AND A VINYL MONOMER HAVING CARBOXYLIC GROUP, A THIOL COMPOUND, WITH AN UNSATURATED EPOXY COMPOUND NIPPON SHOKUBAI CO., LTD. (JP) 2001-02-20 US disclosed
WO-2000049103-A1 A METHOD FOR THE ADHESION OF VINYLIDENE FLUORIDE RESINS TO METAL SUBSTRATES, AND AN ELECTRODE STRUCTURE AND ITS METHOD OF PRODUCTION ATOFINA (FR) 2000-08-24 WO disclosed
EP-0796873-A1 (METH)ACRYLIC SYRUP, PROCESS FOR PREPARING THE SAME, AND PROCESS FOR PREPARING MOLDING MATERIAL CONTAINING (METH)ACRYLIC SYRUP NIPPON SHOKUBAI CO., LTD. (JP) 1997-09-24 EP disclosed
JP-H05142501-A HIGH REFRACTIVE INDEX SPECTACLE LENS TOKYO KEIKAKU:KK 1993-06-11 JP disclosed
JP-H03297638-A PRODUCTION OF COPPER FOIL COATED WITH RADIATION HARDENING TYPE COATING HITACHI CHEM CO LTD 1991-12-27 JP disclosed