SCHEMBL10793095

SCHEMBL10793095

Oc1ccc(O)c(P)c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bromide SCHEMBL28524370 0.97 ALOX5 (0.44) —
Water SCHEMBL9053915 0.97 ALOX5 (0.44) —
Bromide SCHEMBL4584444 0.97 ALOX5 (0.44) —
Chloroacetic Acid SCHEMBL11577602 0.81 CA2 (0.44) —
SCHEMBL29829218 0.78 — —
SCHEMBL4862349 0.78 ALOX5 (0.60) —
SCHEMBL33527 0.78 — —
SCHEMBL19119600 0.77 — —
Phosphine SCHEMBL11514630 0.75 ALOX5 (0.57) —
Hydrogen Sulfide SCHEMBL11691776 0.75 ALOX5 (0.57) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1053136-A A kind of processing procedure and solution thereof of making hologram QIMEI IMAGE CO LTD QINGDAO (CN) 1991-07-17 — — CN claimed
CN-221176220-U Interconnect structure and semiconductor device thereof 台湾积体电路制造股份有限公司 2024-06-18 — — CN disclosed
CN-117500882-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-02-02 — — CN disclosed
CN-117480217-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-30 — — CN disclosed
CN-117460784-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-26 — — CN disclosed
CN-117460785-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-26 — — CN disclosed
CN-117460786-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-26 — — CN disclosed
CN-117440989-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-23 — — CN disclosed
CN-117440988-A Polycarbonate resin composition and molded article 出光兴产株式会社 2024-01-23 — — CN disclosed
CN-117120548-A Polycarbonate resin composition and molded article 出光兴产株式会社 2023-11-24 — — CN disclosed
CN-101553759-A Photosensitive heat curing-type resin composition and flexible printed wiring board KYOCERA CHEM CORP (JP) 2009-10-07 — — CN disclosed
CN-1906029-A Coated metal formed article and method for producing coated metal formed article NAKATA COATING CO LTD (JP) 2007-01-31 — — CN disclosed
CN-1799289-A Flexible wiring board and flex-rigid wiring board SHOWA DENKO KK (JP) 2006-07-05 — — CN disclosed
CN-1071464-C A method of processing using a low volume thin tank processing system EASTMAN KODAK CO (US) 2001-09-19 — — CN disclosed
CN-1118454-A A method of processing using a low volume thin tank processing system EASTMAN KODAK CO (US) 1996-03-13 — — CN disclosed
CN-1053136-A A kind of processing procedure and solution thereof of making hologram QIMEI IMAGE CO LTD QINGDAO (CN) 1991-07-17 — — CN disclosed
CN-1051060-A Electric depositing solution of antiwear non-crystal alloy of iron, nickel, phosphorus and technology thereof WUHAN MATERIALS PROTECTION INS (CN) 1991-05-01 — — CN disclosed
EP-0132789-B1 A PROCESS FOR REACTING AN EPOXY RESIN OR A THIOEPOXIDE WITH A POLYHYDRIC PHENOL, A POLYHYDRIC THIOPHENOL, A CARBOXYLIC ACID OR A CARBOXYLIC ACID ANHYDRIDE THE DOW CHEMICAL COMPANY (US) 1987-12-09 — — EP disclosed
US-4093650-A REACTING A PHOSPHINE, A PROTIC ACID, AND P-BENZOQUINONE THE DOW CHEMICAL COMPANY (US) 1978-06-06 — — US disclosed
US-4093650-A REACTING A PHOSPHINE, A PROTIC ACID, AND P-BENZOQUINONE THE DOW CHEMICAL COMPANY (US) 1978-06-06 — — US disclosed
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