Known targets — ChEMBL curated mechanism
ACHEADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3APH1AAPH1BCHRM2CHRM3EZH2GRIN2AHTR1AHTR1BHTR1DHTR1FHTR3ANCSTNP2RY12PSEN1PSEN2PSENENSIGMAR1SLC6A2SLC6A3SLC6A4
The experimentally established mechanism targets of Bromide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX5 | P09917 | 3/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.41 |
| ▸ | CA12 | O43570 | 4/20 | 0.41 |
| ▸ | CA2 | P00918 | 4/20 | 0.41 |
| ▸ | CA9 | Q16790 | 4/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 4/20 | 0.41 |
| ▸ | TYR | P14679 | 3/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.41 |
| ▸ | LMNA | P02545 | 3/20 | 0.41 |
| ▸ | CA1 | P00915 | 3/20 | 0.41 |
| ▸ | CA7 | P43166 | 2/20 | 0.41 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.41 |
| ▸ | MIF | P14174 | 1/20 | 0.41 |
| ▸ | HTT | P42858 | 1/20 | 0.41 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.41 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.41 |
| ▸ | LCK | P06239 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bromide SCHEMBL28524370 | 1.00 | ALOX5 (0.44) | ALOX5HSD17B10ALDH1A1CA12CA2 | |
| SCHEMBL10793095 | 0.97 | — | — | |
| Water SCHEMBL9053915 | 0.94 | ALOX5 (0.44) | ALOX5HSD17B10ALDH1A1CA12CA2 | |
| Biphenyl SCHEMBL27639430 | 0.84 | ALOX5 (0.56) | ALOX5HSD17B10ALDH1A1ALOX15LMNA | |
| Chloroacetic Acid SCHEMBL11577602 | 0.79 | CA2 (0.44) | ALOX5HSD17B10ALDH1A1CA12CA2 | |
| SCHEMBL29829218 | 0.76 | — | — | |
| SCHEMBL4862349 | 0.76 | ALOX5 (0.60) | ALOX5HSD17B10ALDH1A1CA12CA2 | |
| SCHEMBL33527 | 0.76 | — | — | |
| SCHEMBL19119600 | 0.74 | — | — | |
| Phosphine SCHEMBL11514630 | 0.73 | ALOX5 (0.57) | ALOX5HSD17B10ALDH1A1CA12CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113396056-B | Dry film for hollow device, cured product, and electronic component | 太阳控股株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-118019817-A | Sheet-like curable adhesive and optical member | 琳得科株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117882007-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-117859095-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-09 | — | — | CN | disclosed |
| CN-111505905-B | Dry film, cured product, and electronic component | 太阳控股株式会社 | 2024-03-12 | — | — | CN | disclosed |
| CN-113195584-B | Curable resin composition, dry film, resin-coated copper foil, cured product, and electronic component | 太阳控股株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-113646399-B | Sheet-like adhesive, sealing sheet, electronic device sealing body, and method for manufacturing electronic device sealing body | 琳得科株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-117044390-A | Wiring sheet for three-dimensional molding | 琳得科株式会社 | 2023-11-10 | — | — | CN | disclosed |
| CN-111955053-B | Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device | 琳得科株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-112088185-B | Resin composition, sealing sheet, and sealing body | 琳得科株式会社 | 2023-09-26 | — | — | CN | disclosed |
| EP-1687678-A2 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-08-09 | — | — | EP | disclosed |
| WO-2006054791-A1 | RESIN CURED FILM FOR FLEXIBLE PRINTED WIRING BOARD AND PRODUCTION PROCESS THEREOF | SHOWA DENKO K.K. (JP) | 2006-05-26 | — | — | WO | disclosed |
| CN-1755524-A | Photosensitive thermosetting resin composition, resist-coated printed wiring board, and method for producing same | YAMASAKA CHEMICAL CO LTD (JP) | 2006-04-05 | — | — | CN | disclosed |
| WO-2006033439-A1 | HEAT-CURABLE URETHANE RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2006-03-30 | — | — | WO | disclosed |
| WO-2005116760-A2 | PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT AND USE THEREOF | SHOWA DENKO K.K. (JP) | 2005-12-08 | — | — | WO | disclosed |
| WO-2005052688-A2 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-06-09 | — | — | WO | disclosed |
| CN-1036693-C | Method for forming tin solder durable figures with photosensitive thermosetting resin composition | TAIYO INK MFG CO LTD (JP) | 1997-12-10 | — | — | CN | disclosed |
| CN-1028535-C | Photosensitive thermosetting resin composition | TAIYO INK MFG CO LTD (JP) | 1995-05-24 | — | — | CN | disclosed |
| CN-1081557-A | Adopt photosensitive thermosetting resin composition to form anti-scolding tin method of patterning | TAIYO INK MFG CO LTD (JP) | 1994-02-02 | — | — | CN | disclosed |
| CN-1033389-A | Photosensitive thermosetting resin composition and method for forming solder resist pattern using the same | TAIYO INK MFG CO LTD (JP) | 1989-06-14 | — | — | CN | disclosed |