Tetrapropylammonium

Tetrapropylammonium

SCHEMBL108342

CCC[N+](CCC)(CCC)CCC.CCC[N+](CCC)(CCC)CCC.O=C([O-])[O-]

nearest known ligand 0.62

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GSK3AGSK3BIMPA1

The experimentally established mechanism targets of Tetrapropylammonium. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
SLC22A1 O15245 4/20 0.62
FFAR3 O14843 2/20 0.43
HDAC3 O15379 2/20 0.43
HDAC1 Q13547 2/20 0.43
HDAC2 Q92769 2/20 0.43
HDAC8 Q9BY41 2/20 0.43
CES2 O00748 5/20 0.41
CES1 P23141 5/20 0.41
SLC22A2 O15244 1/20 0.40
BBOX1 O75936 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrapropylammonium SCHEMBL3282336 0.97 SLC22A1 (0.59) SLC22A1FFAR3HDAC3HDAC1HDAC2
Tetrapropylammonium SCHEMBL106250 0.91 SLC22A1 (0.59) SLC22A1FFAR3HDAC3HDAC1HDAC2
Tetrapropylammonium SCHEMBL109162 0.91 SLC22A1 (0.59) SLC22A1FFAR3HDAC3HDAC1HDAC2
Tetrapropylammonium SCHEMBL108600 0.91 SLC22A1 (0.59) SLC22A1FFAR3HDAC3HDAC1HDAC2
Bicarbonate SCHEMBL29011830 0.89 SLC22A1 (0.60) SLC22A1CES2CES1SLC22A2
Bicarbonate SCHEMBL8857005 0.89 SLC22A1 (0.50) SLC22A1FFAR3HDAC3HDAC1HDAC2
Bicarbonate SCHEMBL28712336 0.89 SLC22A1 (0.60) SLC22A1CES2CES1SLC22A2
Tetrapropylammonium SCHEMBL106182 0.88 SLC22A1 (0.56) SLC22A1FFAR3HDAC3HDAC1HDAC2
Bicarbonate SCHEMBL2277811 0.88 SLC22A1 (0.47) SLC22A1FFAR3HDAC3HDAC1HDAC2
Bicarbonate SCHEMBL8857089 0.87 SLC22A1 (0.48) SLC22A1FFAR3HDAC3HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118561313-A Method for synthesizing copper halide-based colloid nanocrystalline at room temperature and application 浙江大学 2024-08-30 CN claimed
US-5693599-A Flux washing agent MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1997-12-02 US claimed
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
US-20260103437-A1 METHOD FOR PRODUCING PURIFIED QUATERNARY AMMONIUM COMPOUND AQUEOUS SOLUTION TOKUYAMA CORPORATION (JP) 2026-04-16 US disclosed
EP-4700067-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPERSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-25 EP disclosed
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-4692941-A2 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20260029706-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPER STRAIGHT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-29 US disclosed
EP-4621486-A2 POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-24 EP disclosed
US-20250289931-A1 POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-18 US disclosed
EP-4592299-A1 SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-30 EP disclosed
US-7132473-B2 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2006-11-07 US disclosed
US-7128976-B2 Composition for film formation, method of film formation, and silica-based film JSR CORPORATION (JP) 2006-10-31 US disclosed
EP-1568744-A1 COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-31 EP disclosed
US-20040219372-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed
US-6797682-B2 TO STRIP A PHOTORESIST LAYER AND A TITANIUM OXIDE IN PRODUCTION OF E.G. SEMICONDUCTOR INTEGRATED CIRCUITS, PRINTED WIRING BOARDS AND LIQUID CRYSTALS TOSOH CORPORATION (JP) 2004-09-28 US disclosed
US-20030091838-A1 Composition for film formation, method of film formation, and silica-based film JSR CORPORATION (JP) 2003-05-15 US disclosed
US-20020128164-A1 Resist stripper TOSOH CORPORATION 2002-09-12 US disclosed
EP-1211563-A1 Resist stripper Tosoh Corporation (JP) 2002-06-05 EP disclosed
US-5693599-A Flux washing agent MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1997-12-02 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260103437-A1 METHOD FOR PRODUCING PURIFIED QUATERNARY AMMONIUM COMPOUND AQUEOUS SOLUTION RAB5IF, AP3D1, AP3S1 SLC22A1 4239/4885FFAR3 1039/4885HDAC3 936/4885
US-20250289931-A1 POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS ASH2L, PUF60, IDUA SLC22A1 1953/4885FFAR3 1313/4885HDAC3 2829/4885
US-20260029706-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPER STRAIGHT SMC2, F12, SMC1A SLC22A1 2667/4885FFAR3 383/4885HDAC3 3988/4885
US-20260118767-A1 REVERSE PATTERNING PROCESS EFNA1, EPHA4, ETV6 SLC22A1 4619/4885FFAR3 2087/4885HDAC3 4451/4885
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SMC1A, SPOUT1, LBR SLC22A1 2467/4885FFAR3 110/4885HDAC3 2256/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.