Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | CHRM2 | P08172 | 5/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 3/20 | 0.34 |
| ▸ | CHRM4 | P08173 | 2/20 | 0.34 |
| ▸ | CHRM3 | P20309 | 2/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 2/20 | 0.31 |
| ▸ | CA1 | P00915 | 2/20 | 0.31 |
| ▸ | CA2 | P00918 | 2/20 | 0.31 |
| ▸ | CA9 | Q16790 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7024800 | 0.83 | — | — | |
| SCHEMBL2962835 | 0.83 | GPX4 (0.37) | — | |
| SCHEMBL9696641 | 0.78 | ALDH1A1 (0.36) | TSHRKMT2A | |
| SCHEMBL17662660 | 0.71 | — | — | |
| SCHEMBL6367869 | 0.70 | NLRP3 (0.39) | TSHRMEN1CYP2D6KMT2ACA12 | |
| SCHEMBL6367856 | 0.70 | KDM4E (0.30) | — | |
| SCHEMBL4380706 | 0.68 | — | — | |
| SCHEMBL7715622 | 0.67 | OGA (0.37) | TSHRCYP2D6CA12CA1CA2 | |
| SCHEMBL23264992 | 0.67 | CYP1A2 (0.35) | TSHRCHRM2CHRM4CHRM3CYP2D6 | |
| SCHEMBL2960975 | 0.67 | CYP1A2 (0.35) | TSHRCHRM2CHRM4CHRM3CYP2D6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| EP-1655321-B1 | POLYMERIZABLE COMPOSITIONS AND MOLDED ARTICLES PRODUCED BY USING THE SAME | ZEON CORP (JP) | 2012-11-21 | — | — | EP | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-7771834-B2 | Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material | ZEON CORPORATION (JP) | 2010-08-10 | — | — | US | disclosed |
| US-7666966-B2 | Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material | ZEON CORPORATION (JP) | 2010-02-23 | — | — | US | disclosed |
| US-20100015871-A1 | MOLDED ARTICLE, PROCESS FOR PRODUCING THE SAME, AND CROSSLINKED MOLDED ARTICLE AND COPPER-CLAD LAMINATE EACH OBTAINED THEREFROM | ZEON CORPORATION (JP) | 2010-01-21 | — | — | US | disclosed |
| EP-2067812-A1 | MOLDED OBJECT, PROCESS FOR PRODUCING THE SAME, AND CROSSLINKED MOLDING AND COPPER-CLAD LAMINATE EACH OBTAINED FROM THE SAME | ZEON CORPORATION (JP) | 2009-06-10 | — | — | EP | disclosed |
| US-20090036614-A1 | METHOD OF MANUFACTURING THERMOPLASTIC RESIN, CROSSLINKED RESIN, AND CROSSLINKED RESIN COMPOSITE MATERIAL | ZEON CORPORATION | 2009-02-05 | — | — | US | disclosed |
| US-7476716-B2 | Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material | ZEON CORPORATION (JP) | 2009-01-13 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-7381782-B2 | Polymerizable composition and molded articles produced by using the same | ZEON CORPORATION (JP) | 2008-06-03 | — | — | US | disclosed |
| EP-1535941-B1 | PROCESSES FOR PRODUCING THERMOPLASTIC RESINS, CROSSLINKED RESINS AND CROSSLINKED RESIN COMPOSITE MATERIALS | ZEON CORP (JP) | 2007-09-12 | — | — | EP | disclosed |
| US-20070191563-A1 | Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material | ZEON CORPORATION (JP) | 2007-08-16 | — | — | US | disclosed |
| US-20060258828-A1 | Polymerizable composition and molded articles produced by using the same | ZEON CORPORATION (JP) | 2006-11-16 | — | — | US | disclosed |
| US-20060211834-A1 | Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material | ZEON CORPORATION (JP) | 2006-09-21 | — | — | US | disclosed |
| EP-1655321-A1 | POLYMERIZABLE COMPOSITIONS AND MOLDED ARTICLES PRODUCED BY USING THE SAME | Zeon Corporation (JP) | 2006-05-10 | — | — | EP | disclosed |
| EP-1535941-A1 | PROCESSES FOR PRODUCING THERMOPLASTIC RESINS, CROSSLINKED RESINS AND CROSSLINKED RESIN COMPOSITE MATERIALS | ZEON CORPORATION (JP) | 2005-06-01 | — | — | EP | disclosed |
| US-6372854-B1 | POLYALKENAMERS USED AS PHOTORESISTS HAVING EXCELLENT OPTICAL ELECTRICAL PROPERTIES; HIGH RIGIDITY; HEAT RESISTANCE; ADHESION AND WEAR RESISTANCE; HYDROGENATION; ACIDOLYSIS | MITSUI CHEMICALS, INC. (JP) | 2002-04-16 | — | — | US | disclosed |