⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1097437 | 0.91 | — | — | |
| SCHEMBL7114758 | 0.83 | CA2 (0.30) | — | |
| SCHEMBL18940535 | 0.81 | ALDH1A1 (0.31) | — | |
| SCHEMBL5586705 | 0.79 | — | — | |
| SCHEMBL28429657 | 0.79 | — | — | |
| SCHEMBL991537 | 0.79 | APP (0.38) | — | |
| SCHEMBL6783827 | 0.78 | LMNA (0.34) | — | |
| SCHEMBL18940694 | 0.75 | — | — | |
| SCHEMBL329186 | 0.74 | — | — | |
| SCHEMBL315210 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-8134268-A | — | — | None | — | — | JP | disclosed |
| US-10086594-B2 | Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device | LINTEC CORPORATION (JP) | 2018-10-02 | — | — | US | disclosed |
| US-9786541-B2 | Dicing sheet with protective film forming layer and chip fabrication method | LINTEC CORPORATION (JP) | 2017-10-10 | — | — | US | disclosed |
| US-9754811-B2 | Dicing sheet with protective film forming layer and method for producing chip | LINTEC CORPORATION (JP) | 2017-09-05 | — | — | US | disclosed |
| US-9443750-B2 | Dicing sheet with protective film-forming layer, and method for producing chip | LINTEC CORPORATION (JP) | 2016-09-13 | — | — | US | disclosed |
| US-20160218077-A1 | Composite Sheet for Resin Film Formation | LINTEC CORPORATION (JP) | 2016-07-28 | — | — | US | disclosed |
| US-9296925-B2 | Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device | LINTEC CORPORATION (JP) | 2016-03-29 | — | — | US | disclosed |
| US-20150228526-A1 | DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND METHOD FOR PRODUCING CHIP | LINTEC CORPORATION (JP) | 2015-08-13 | — | — | US | disclosed |
| US-20150225613-A1 | Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and Method for Producing Semiconductor Device | LINTEC CORPORATION (JP) | 2015-08-13 | — | — | US | disclosed |
| US-20150165743-A1 | Sheet Having Adhesive Resin Layer Attached Thereto, and Method for Producing Semiconductor Device | LINTEC CORPORATION (JP) | 2015-06-18 | — | — | US | disclosed |
| EP-2080783-A1 | CALCIUM CARBONATE TREATED WITH CURING ACTIVE INGREDIENT | Shiraishi Kogyo Kaisha, Ltd. (JP) | 2009-07-22 | — | — | EP | disclosed |
| US-20070293621-A1 | Modified calcium carbonate surface-treated with a fatty acid and silicic acid or a rosin and silicic acid; an inorganic filler exhibiting an oil absorption, and a vulcanization promoter liquid at ordinary temperatures; storage stability; excellent in resistance to heat build-up; designability | SHIRAISHI KOGYO KAISHA, LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| EP-1785452-A1 | POWDERY WHITE VULCANIZATION PROMOTER COMPOSITION AND RUBBER COMPOSITIONS | Shiraishi Kogyo Kaisha, Ltd. (JP) | 2007-05-16 | — | — | EP | disclosed |
| US-6689889-B2 | USING N-ACRYLOXYPHENYLANILINE NEOMENTHYLAMIDE | BAYER AKTIENGESELLSCHAFT (DE) | 2004-02-10 | — | — | US | disclosed |
| EP-0896987-B1 | PROCESS FOR PREPARING SURFACE-TREATED CARBON BLACK AND RUBBER COMPOSITION | MITSUBISHI CHEM CORP (JP) | 2003-06-18 | — | — | EP | disclosed |
| US-20020133017-A1 | Chromatographic separation of enantiomers of lactones | DAICEL CHEMICAL INDUSTRIES, LTD (JP) | 2002-09-19 | — | — | US | disclosed |
| US-6274736-B1 | ISOMER MIXTURES | BAYER AKTIENGESELLSCHAFT (DE) | 2001-08-14 | — | — | US | disclosed |
| US-6248808-B1 | USING ORGANOSILICON COMPOUND | MITSUBISHI CHEMICAL CORPORATION (JP) | 2001-06-19 | — | — | US | disclosed |
| EP-0896987-A1 | PROCESS FOR PREPARING SURFACE-TREATED CARBON BLACK AND RUBBER COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 1999-02-17 | — | — | EP | disclosed |
| JP-H08134268-A | SOLE RUBBER COMPOSITION IMPROVED IN ABRASION RESISTANCE | KOKUSAI SHOSHA:KK | 1996-05-28 | — | — | JP | disclosed |