SCHEMBL10960203

SCHEMBL10960203

C=Cc1ccc(N2C(=O)C=CC2=O)cc1N1C(=O)C=CC1=O

nearest known ligand 0.48

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 16/20 0.48
▸ FAAH O00519 8/20 0.48
▸ TLR9 Q9NR96 2/20 0.47
▸ G6PD P11413 1/20 0.47
▸ HSP90AA1 P07900 4/20 0.44
▸ PKM P14618 2/20 0.41
▸ MAPK1 P28482 1/20 0.41
▸ NPSR1 Q6W5P4 1/20 0.41
▸ TDP1 Q9NUW8 1/20 0.41
▸ ALDH1A1 P00352 1/20 0.40
▸ HTT P42858 1/20 0.40
▸ ATM Q13315 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14381240 0.77 MGLL (0.48) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL10884128 0.77 G6PD (0.62) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL10880929 0.76 CCR6 (0.54) MGLLFAAHHSP90AA1PKMMAPK1
SCHEMBL585297 0.76 TLR9 (0.61) MGLLFAAHTLR9HSP90AA1PKM
SCHEMBL9718088 0.73 MGLL (0.64) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL10587424 0.72 NPSR1 (0.57) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL94095 0.72 MGLL (0.57) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL10585998 0.72 MGLL (0.57) MGLLFAAHTLR9G6PDHSP90AA1
SCHEMBL1258213 0.71 MGLL (0.65) MGLLFAAHHSP90AA1PKMMAPK1
SCHEMBL19511891 0.70 MGLL (0.58) MGLLFAAHTLR9G6PDHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4506042-A MOLDING, LAMINATION, VARISH MITSUI TOATSU CHEMICALS, INC. (JP) 1985-03-19 — — US disclosed
US-4401777-A Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition MITSUI TOATSU CHEMICALS, INC. (JP) 1983-08-30 — — US disclosed
EP-0077840-A1 Curable resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1983-05-04 — — EP disclosed
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