SCHEMBL1100529

SCHEMBL1100529

O=C(O)c1ccc(Oc2cccc(C(c3cccc(Oc4ccc(C(=O)O)c(C(=O)O)c4)c3)(C(F)(F)F)C(F)(F)F)c2)cc1C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.51
HPSE Q9Y251 1/20 0.51
TDP1 Q9NUW8 4/20 0.46
GALK1 P51570 1/20 0.46
CASP6 P55212 1/20 0.46
MCL1 Q07820 1/20 0.46
PLEC Q15149 1/20 0.46
DUSP3 P51452 1/20 0.45
PTPN5 P54829 1/20 0.45
PTPN11 Q06124 1/20 0.45
KDM4E B2RXH2 1/20 0.43
AKR1C3 P42330 2/20 0.43
AKR1C2 P52895 1/20 0.43
ALDH1A1 P00352 1/20 0.43
LMNA P02545 1/20 0.41
PYGL P06737 3/20 0.41
PYGM P11217 3/20 0.40
MAPK1 P28482 1/20 0.40
GFER P55789 1/20 0.40
NPC1 O15118 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29779713 1.00 POLB (0.51) POLBHPSETDP1GALK1CASP6
SCHEMBL8924121 0.92 HPSE (0.49) POLBHPSETDP1GALK1CASP6
SCHEMBL125376 0.87 POLB (0.55) POLBHPSETDP1GALK1CASP6
SCHEMBL29405914 0.87 POLB (0.55) POLBHPSETDP1GALK1CASP6
SCHEMBL9852598 0.86 HPSE (0.49) POLBHPSETDP1GALK1CASP6
SCHEMBL28394217 0.85 HPSE (0.48) POLBHPSETDP1GALK1CASP6
SCHEMBL28885523 0.85 HPSE (0.48) POLBHPSETDP1GALK1CASP6
SCHEMBL8922344 0.84 SRD5A2 (0.53) POLBKDM4EAKR1C3NPC1CYP2C9
SCHEMBL8922389 0.82 AKR1C3 (0.63) POLBKDM4EAKR1C3NPC1CYP2C9
SCHEMBL1099667 0.82 POLB (0.54) POLBHPSETDP1GALK1CASP6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025047132-A1 RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-03-06 WO disclosed
WO-2024171805-A1 POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, AND ELECTRONIC COMPONENT 東レ株式会社 2024-08-22 WO disclosed
WO-2024111466-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE 東レ株式会社 2024-05-30 WO disclosed
WO-2023042608-A1 POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, CURED OBJECT, ORGANIC EL DISPLAY, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE 東レ株式会社 2023-03-23 WO disclosed
CN-114174422-A Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board DIC株式会社 2022-03-11 CN disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
WO-2021039111-A1 RESIN COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL USING SAME, IMPREGNATED BASE MATERIAL, CIRCUIT BASE BOARD, BUILD-UP FILM, PREPREG, CARBON FIBER COMPOSITE MATERIAL, SOLDER RESIST, DRY FILM, AND PRINTED CIRCUIT BOARD DIC株式会社 2021-03-04 WO disclosed
CN-112384489-A Method for producing organic compound 尤尼吉可株式会社 2021-02-19 CN disclosed
CN-110869848-A Laminated structure, dry film, and flexible printed circuit board 太阳油墨制造株式会社 2020-03-06 CN disclosed
US-20030092870-A1 Novel aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2003-05-15 US disclosed
EP-1288191-A2 Novel aromatic diamine and polyimide thereof Mitsui Chemicals, Inc. (JP) 2003-03-05 EP disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 US disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 US disclosed
US-5670084-A Alignment layer material for liquid crystal display devices HOECHST AKTIENGESELLSCHAFT (DE) 1997-09-23 US disclosed
EP-0708149-A1 Alignment layer material for liquid crystal display devices HOECHST AKTIENGESELLSCHAFT (DE) 1996-04-24 EP disclosed
US-5194518-A Polyimides, prepregs, fluoropolymers NITTO DENKO CORPORATION (JP) 1993-03-16 US disclosed
EP-0422379-A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet NITTO DENKO CORPORATION (JP) 1991-04-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030092870-A1 Novel aromatic diamine and polyimide thereof DDT, AOC1, H1-4 POLB 1669/4885HPSE 4502/4885TDP1 799/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.