SCHEMBL11024319

SCHEMBL11024319

O=C1C=CC(=O)N1C(CCc1ccccc1)N1C(=O)C=CC1=O

nearest known ligand 0.53

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 4/20 0.53
GSK3B P49841 4/20 0.53
MGLL Q99685 3/20 0.53
POLB P06746 1/20 0.49
FAAH O00519 1/20 0.49
ACP3 P15309 1/20 0.47
CASP3 P42574 1/20 0.42
ANPEP P15144 2/20 0.41
ERAP1 Q9NZ08 2/20 0.41
ERAP2 Q6P179 1/20 0.41
KDM4E B2RXH2 2/20 0.40
TSHR P16473 1/20 0.40
MCL1 Q07820 1/20 0.40
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1824376 0.79 DNMT1 (0.48) GSK3AGSK3BMGLLPOLBFAAH
SCHEMBL16628548 0.76 POLB (0.50) GSK3AGSK3BMGLLPOLBFAAH
SCHEMBL28234264 0.69 GSK3A (1.00) GSK3AGSK3BMGLLFAAHCASP3
SCHEMBL211905 0.69 GSK3A (1.00) GSK3AGSK3BMGLLFAAHCASP3
SCHEMBL27458809 0.69 TDP1 (0.66) GSK3AGSK3BMGLLPOLBMEN1
SCHEMBL1703986 0.69 MGLL (0.42) GSK3AGSK3BMGLLFAAH
SCHEMBL10536673 0.67 ALDH1A1 (0.68) POLBKDM4ETSHRMEN1KMT2A
SCHEMBL3380286 0.67 GSK3A (1.00) GSK3AGSK3BMGLLFAAHCASP3
SCHEMBL598212 0.65 TDP1 (0.55) ACP3ANPEPERAP1ERAP2TSHR
SCHEMBL25435490 0.64 MGLL (1.00) GSK3AGSK3BMGLLFAAHCASP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0035760-B1 THERMOSETTING RESIN COMPOSITION, PROCESS FOR PREPARATION THEREOF AND CURED PRODUCT THEREOF Hitachi, Ltd. (JP) 1985-07-03 EP disclosed
US-4393177-A POLY (PHENYLMETHYLENE) POLYMALEIMIDE AND TRIALLYL ISOCYANURATE HITACHI, LTD. (JP) 1983-07-12 US disclosed
EP-0035760-A2 Thermosetting resin composition, process for preparation thereof and cured product thereof Hitachi, Ltd. (JP) 1981-09-16 EP disclosed