SCHEMBL1108311

SCHEMBL1108311

CNc1cc(NC(=O)c2cccc(C(C)=O)c2)c(O)cc1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CREBBP Q92793 4/20 0.49
KMT2A Q03164 8/20 0.48
MEN1 O00255 7/20 0.48
PABPC1 P11940 1/20 0.48
DUSP3 P51452 1/20 0.48
PTPN5 P54829 1/20 0.48
PTPN11 Q06124 1/20 0.48
EIF4H Q15056 1/20 0.48
CTDSP1 Q9GZU7 1/20 0.48
KCNMA1 Q12791 2/20 0.48
HDAC1 Q13547 1/20 0.47
HDAC8 Q9BY41 1/20 0.47
HDAC6 Q9UBN7 1/20 0.47
POLB P06746 1/20 0.47
RAB9A P51151 3/20 0.46
NPC1 O15118 2/20 0.46
ALDH1A1 P00352 2/20 0.46
RXFP1 Q9HBX9 1/20 0.45
HDAC2 Q92769 1/20 0.45
PYGM P11217 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1108322 0.87 HDAC1 (0.59) CREBBPKMT2AMEN1PABPC1DUSP3
SCHEMBL13986877 0.86 KCNMA1 (0.47) KMT2AMEN1KCNMA1HDAC1POLB
SCHEMBL13520186 0.85 NPC1 (0.53) CREBBPKMT2AMEN1HDAC1HDAC8
SCHEMBL9927400 0.83 KMT2A (0.61) CREBBPKMT2AMEN1HDAC1HDAC8
SCHEMBL10030653 0.83 KMT2A (0.51) CREBBPKMT2AMEN1HDAC1HDAC8
SCHEMBL1108314 0.83 KCNMA1 (0.52) CREBBPKMT2AMEN1PABPC1DUSP3
SCHEMBL10030691 0.81 KCNMA1 (0.48) KMT2AMEN1KCNMA1HDAC1POLB
SCHEMBL26346295 0.81 MEN1 (0.45) CREBBPKMT2AMEN1PABPC1DUSP3
SCHEMBL1108309 0.80 KCNMA1 (0.45) CREBBPKMT2AMEN1PABPC1DUSP3
SCHEMBL677965 0.80 KCNMA1 (0.45) CREBBPKMT2AMEN1PABPC1DUSP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
EP-2191067-B1 PAPER COMPRISING POLYBENZAZOLE OR PRECURSOR THEREOF TEIJIN ARAMID BV (NL) 2012-06-20 EP disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20110083820-A1 PAPER COMPRISING POLYBENZAZOLE OR PRECURSOR THEREOF TEIJIN ARAMID B.V. (NL) 2011-04-14 US disclosed
US-20110083820-A1 PAPER COMPRISING POLYBENZAZOLE OR PRECURSOR THEREOF TEIJIN ARAMID B.V. (NL) 2011-04-14 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed
WO-2009033983-A1 PAPER COMPRISING POLYBENZAZOLE OR PRECURSOR THEREOF TEIJIN ARAMID B.V. (NL) 2009-03-19 WO disclosed
EP-2037039-A1 Paper comprising polybenzazole or precursor thereof Teijin Aramid B.V. (NL) 2009-03-18 EP disclosed