SCHEMBL1108314

SCHEMBL1108314

CNc1ccc(O)c(NC(=O)c2cccc(C(C)=O)c2)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 3/20 0.52
KMT2A Q03164 5/20 0.52
MEN1 O00255 4/20 0.52
PABPC1 P11940 1/20 0.52
DUSP3 P51452 1/20 0.52
PTPN5 P54829 1/20 0.52
PTPN11 Q06124 1/20 0.52
EIF4H Q15056 1/20 0.52
CTDSP1 Q9GZU7 1/20 0.52
POLB P06746 1/20 0.51
ADRB2 P07550 1/20 0.48
GAA P10253 1/20 0.48
MAPT P10636 1/20 0.48
HDAC1 Q13547 4/20 0.48
NPC1 O15118 3/20 0.48
RAB9A P51151 3/20 0.48
CREBBP Q92793 2/20 0.47
ALDH1A1 P00352 2/20 0.47
HDAC2 Q92769 1/20 0.47
RXFP1 Q9HBX9 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10030653 0.89 KMT2A (0.51) KMT2AMEN1POLBGAAMAPT
SCHEMBL676658 0.88 KMT2A (0.49) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL676656 0.88 AR (0.53) KMT2AMEN1POLBHDAC1NPC1
SCHEMBL1108328 0.88 AR (0.53) KMT2AMEN1POLBHDAC1NPC1
SCHEMBL677387 0.87 KMT2A (0.48) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL677382 0.87 MAPT (0.45) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL1108318 0.86 NQO2 (0.46) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL677407 0.85 PGR (0.54) KMT2AMEN1POLBHDAC1NPC1
SCHEMBL1108322 0.85 HDAC1 (0.59) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL677398 0.84 KMT2A (0.48) KCNMA1KMT2AMEN1PABPC1DUSP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed