SCHEMBL1108322

SCHEMBL1108322

CNc1cc(-c2ccc(O)c(NC(=O)c3cccc(C(C)=O)c3)c2)ccc1O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 9/20 0.59
HDAC2 Q92769 3/20 0.59
KCNMA1 Q12791 3/20 0.51
MEN1 O00255 2/20 0.51
KMT2A Q03164 2/20 0.51
PABPC1 P11940 1/20 0.51
DUSP3 P51452 1/20 0.51
PTPN5 P54829 1/20 0.51
PTPN11 Q06124 1/20 0.51
EIF4H Q15056 1/20 0.51
CTDSP1 Q9GZU7 1/20 0.51
KDM4E B2RXH2 1/20 0.50
APOBEC3A P31941 1/20 0.50
GFER P55789 1/20 0.50
APOBEC3G Q9HC16 1/20 0.50
ABCB1 P08183 1/20 0.49
ABCC1 P33527 1/20 0.49
NPC1 O15118 2/20 0.47
RAB9A P51151 2/20 0.47
ALDH1A1 P00352 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1108311 0.87 CREBBP (0.49) HDAC1HDAC2KCNMA1MEN1KMT2A
SCHEMBL13520186 0.86 NPC1 (0.53) HDAC1HDAC2MEN1KMT2AGFER
SCHEMBL1108314 0.85 KCNMA1 (0.52) HDAC1HDAC2KCNMA1MEN1KMT2A
SCHEMBL26346295 0.83 MEN1 (0.45) HDAC1HDAC2KCNMA1MEN1KMT2A
SCHEMBL677965 0.82 KCNMA1 (0.45) HDAC1HDAC2KCNMA1MEN1KMT2A
SCHEMBL1108309 0.82 KCNMA1 (0.45) HDAC1HDAC2KCNMA1MEN1KMT2A
SCHEMBL677387 0.81 KMT2A (0.48) HDAC1KCNMA1MEN1KMT2APABPC1
SCHEMBL25533257 0.80 PRKCI (0.60) HDAC1HDAC2MEN1KMT2AABCB1
SCHEMBL9927400 0.80 KMT2A (0.61) HDAC1HDAC2MEN1KMT2ANPC1
SCHEMBL1108319 0.79 ESR1 (0.44) HDAC1HDAC2KCNMA1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed