SCHEMBL1108318

SCHEMBL1108318

CNc1ccc(O)c(NC(=O)c2cc(O)cc(C(C)=O)c2)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NQO2 P16083 1/20 0.46
HDAC1 Q13547 2/20 0.45
KCNMA1 Q12791 6/20 0.43
CA5A P35218 1/20 0.43
HPSE Q9Y251 1/20 0.41
TOP1 P11387 4/20 0.41
TOP2A P11388 2/20 0.41
TOP2B Q02880 2/20 0.41
HDAC2 Q92769 1/20 0.40
KMT2A Q03164 2/20 0.40
MEN1 O00255 1/20 0.40
PABPC1 P11940 1/20 0.40
DUSP3 P51452 1/20 0.40
PTPN5 P54829 1/20 0.40
PTPN11 Q06124 1/20 0.40
EIF4H Q15056 1/20 0.40
CTDSP1 Q9GZU7 1/20 0.40
SNCA P37840 1/20 0.39
GAA P10253 1/20 0.38
TERT O14746 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1108314 0.86 KCNMA1 (0.52) HDAC1KCNMA1TOP1HDAC2KMT2A
SCHEMBL1108313 0.80 HPGD (0.49) HDAC1KCNMA1HPSEHDAC2KMT2A
SCHEMBL1108320 0.80 HDAC1 (0.48) HDAC1KCNMA1HPSETOP1HDAC2
SCHEMBL13256343 0.80 KMT2A (0.54) NQO2TOP1TOP2ATOP2BKMT2A
SCHEMBL676652 0.77 HDAC1 (0.46) HDAC1KCNMA1HPSEHDAC2KMT2A
SCHEMBL13657050 0.76 KMT2A (0.60) TOP1TOP2ATOP2BKMT2AMEN1
SCHEMBL12376434 0.76 NQO2 (0.51) NQO2CA5ATOP1TOP2ATOP2B
SCHEMBL10030699 0.75 KMT2A (0.49) HDAC1TOP1HDAC2KMT2AMEN1
SCHEMBL1108328 0.75 AR (0.53) HDAC1HDAC2KMT2AMEN1
SCHEMBL676656 0.75 AR (0.53) HDAC1HDAC2KMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed