SCHEMBL1108320

SCHEMBL1108320

CNc1ccc(O)c(NC(=O)c2ccc(C(C)(C)c3ccc(C(C)=O)cc3)cc2)c1

nearest known ligand 0.48

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 4/20 0.48
KCNMA1 Q12791 5/20 0.45
HPSE Q9Y251 1/20 0.44
KMT2A Q03164 2/20 0.43
NR1H4 Q96RI1 2/20 0.43
POLB P06746 1/20 0.42
RXFP1 Q9HBX9 1/20 0.41
HDAC2 Q92769 1/20 0.41
TOP1 P11387 1/20 0.40
HDAC3 O15379 2/20 0.40
HDAC6 Q9UBN7 2/20 0.40
HDAC11 Q96DB2 1/20 0.40
HDAC8 Q9BY41 1/20 0.40
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL676652 0.86 HDAC1 (0.46) HDAC1KCNMA1HPSEKMT2ANR1H4
SCHEMBL1108313 0.85 HPGD (0.49) HDAC1KCNMA1HPSEKMT2ANR1H4
SCHEMBL13380465 0.82 HDAC3 (0.54) KMT2ANR1H4POLBRXFP1HDAC3
SCHEMBL10030699 0.81 KMT2A (0.49) HDAC1KMT2APOLBRXFP1HDAC2
SCHEMBL677388 0.81 AR (0.47) HDAC1KMT2ANR1H4POLBHDAC2
SCHEMBL1108314 0.80 KCNMA1 (0.52) HDAC1KCNMA1KMT2APOLBRXFP1
SCHEMBL1108318 0.80 NQO2 (0.46) HDAC1KCNMA1HPSEKMT2AHDAC2
SCHEMBL2605538 0.78 KCNMA1 (0.71) HDAC1KCNMA1KMT2ANPC1RAB9A
SCHEMBL29999394 0.77 MEN1 (0.56) HDAC1KCNMA1HPSEKMT2APOLB
SCHEMBL28918150 0.77 MEN1 (0.56) HDAC1KCNMA1HPSEKMT2APOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed