SCHEMBL1109610

SCHEMBL1109610

[NH]c1cccc(-c2nnn[nH]2)c1

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 1/20 0.32
IDO1 P14902 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12761250 0.86 GP6 (0.37) ENPP2IDO1
SCHEMBL4655029 0.79 GP6 (0.49)
SCHEMBL859970 0.78 HSD17B1 (0.52)
SCHEMBL702625 0.78 DCUN1D1 (0.50) IDO1
SCHEMBL4644949 0.78 IDO1 (0.42) ENPP2IDO1
SCHEMBL13113241 0.78 ENPP2 (0.32) ENPP2IDO1
SCHEMBL513232 0.78 ALDH1A1 (0.44) IDO1
SCHEMBL2644693 0.78 ENPP2 (0.32) ENPP2IDO1
SCHEMBL704854 0.78 MGAM (0.43) IDO1
SCHEMBL1196049 0.78 ENPP2 (0.32) ENPP2IDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2280309-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2016-02-24 EP disclosed
US-20130280654-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2013-10-24 US disclosed
US-8530119-B2 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-10 US disclosed
US-8492469-B2 Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film SUMITOMO BAKELITE CO., LTD. (JP) 2013-07-23 US disclosed
US-20120100484-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-26 US disclosed
US-20110136952-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO., LTD. (JP) 2011-06-09 US disclosed
EP-2280309-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM Sumitomo Bakelite Co., Ltd. (JP) 2011-02-02 EP disclosed