SCHEMBL1109638

SCHEMBL1109638

CO[Si](OC)(OC)c1ccccc1-c1ccccc1[Si](OC)(OC)OC

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.37
SMN1; SMN2 Q16637 4/20 0.37
KDM4E B2RXH2 3/20 0.37
CDC25A P30304 3/20 0.37
CDC25B P30305 3/20 0.37
POLB P06746 2/20 0.37
MAPT P10636 2/20 0.37
TDP1 Q9NUW8 2/20 0.37
CYP1A2 P05177 2/20 0.37
CYP2C19 P33261 2/20 0.37
HPGD P15428 2/20 0.37
RAB9A P51151 2/20 0.37
MAP2K7 O14733 1/20 0.37
GMNN O75496 1/20 0.37
LMNA P02545 1/20 0.37
TP53 P04637 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2D6 P10635 1/20 0.37
CYP2C9 P11712 1/20 0.37
ALOX15 P16050 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1637769 0.87 KDM4E (0.30) ALDH1A1SMN1; SMN2KDM4ECDC25ACDC25B
SCHEMBL29975082 0.86 ALDH1A1 (0.38) ALDH1A1SMN1; SMN2KDM4EMAPTHPGD
SCHEMBL7188378 0.86 ALDH1A1 (0.38) ALDH1A1SMN1; SMN2KDM4EMAPTHPGD
SCHEMBL332012 0.86 ALDH1A1 (0.41) ALDH1A1SMN1; SMN2KDM4ECDC25ACDC25B
SCHEMBL30264142 0.86 ALDH1A1 (0.41) ALDH1A1SMN1; SMN2KDM4ECDC25ACDC25B
Benzene SCHEMBL28228276 0.83 CA4 (0.41) ALDH1A1SMN1; SMN2KDM4EPOLBMAPT
SCHEMBL13027844 0.77 ALDH1A1 (0.35) ALDH1A1SMN1; SMN2KDM4EPOLBCYP1A2
SCHEMBL106098 0.77 TSHR (0.43) ALDH1A1SMN1; SMN2KDM4EPOLBTDP1
SCHEMBL1639809 0.77 ALDH1A1 (0.36) ALDH1A1SMN1; SMN2KDM4ECDC25ACDC25B
SCHEMBL30676960 0.77 ALDH1A1 (0.35) ALDH1A1SMN1; SMN2KDM4EPOLBCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2280309-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2016-02-24 EP disclosed
EP-1391476-B1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2015-12-09 EP disclosed
US-20130280654-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2013-10-24 US disclosed
US-8536242-B2 Photocurable composition SEKISUI CHEMICAL CO., LTD. (JP) 2013-09-17 US disclosed
US-8492469-B2 Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film SUMITOMO BAKELITE CO., LTD. (JP) 2013-07-23 US disclosed
US-20110136952-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO., LTD. (JP) 2011-06-09 US disclosed
US-20110097669-A1 PHOTOCURABLE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2011-04-28 US disclosed
EP-2280309-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM Sumitomo Bakelite Co., Ltd. (JP) 2011-02-02 EP disclosed
US-7312013-B2 Photoreactive composition SEKISUI CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed