SCHEMBL1116614

SCHEMBL1116614

CCCCOOC(=O)CCC(C)(C(C)(C)C)C(C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.35
ALDH1A1 P00352 2/20 0.34
ATM Q13315 1/20 0.32
NAAA Q02083 1/20 0.32
HPGD P15428 1/20 0.31
TSHR P16473 1/20 0.31
CES2 O00748 1/20 0.30
CES1 P23141 1/20 0.30
DNM1 Q05193 1/20 0.30
LMNA P02545 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL248558 0.86 DGKA (0.37) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL3699388 0.83 DGKA (0.35) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL4461667 0.82 DGKA (0.50) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL28043998 0.81 DGKA (0.45) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL31311137 0.81 NAAA (0.40) DGKANAAACES2CES1DNM1
SCHEMBL4735510 0.79 ALDH1A1 (0.48) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL5698407 0.79 DGKA (0.48) DGKAALDH1A1ATMNAAAHPGD
SCHEMBL28111166 0.79 TSHR (0.32) TSHR
SCHEMBL25218388 0.78 DGKA (0.46) DGKAALDH1A1NAAATSHRCES2
SCHEMBL574866 0.78 DGKA (0.46) DGKAALDH1A1NAAATSHRCES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 434 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3112407-B1 RUBBER COMPOSITION FOR FLEXIBLE COUPLING HYUNDAI MOTOR CO LTD (KR) 2026-03-18 EP claimed
CN-117062860-A Low odor thermally expandable material 泽费罗斯股份有限公司 2023-11-14 CN claimed
CN-112703234-B Two-part adhesive composition 汉高股份有限及两合公司 2023-07-14 CN claimed
EP-3929250-B1 LOW DIELECTRIC LOSS FACTOR POLYAMIDE MOLDING COMPOUNDS EMS CHEMIE AG (CH) 2023-05-24 EP claimed
CN-114085514-A Thermoplastic molding composition and molded article 埃姆斯化学股份公司 2022-02-25 CN claimed
CN-112409513-B Method for preparing ethylene polymer by microreactor and microreactor 中国科学院化学研究所 2022-02-08 CN claimed
CN-113897047-A Thermoplastic molding composition and molded article 埃姆斯化学股份公司 2022-01-07 CN claimed
EP-3929250-A1 LOW DIELECTRIC LOSS FACTOR POLYAMIDE MOLDING COMPOUNDS EMS-CHEMIE AG (CH) 2021-12-29 EP claimed
EP-3929249-A1 LOW DIELECTRIC LOSS FACTOR POLYAMIDE MOLDING COMPOUND EMS-CHEMIE AG (CH) 2021-12-29 EP claimed
EP-3549977-B1 RUBBER COMPOSITION FOR TIRE TREAD, METHOD FOR PRODUCING THE COMPOSITION, AND TIRE MANUFACTURED USING THE COMPOSITION HANKOOK TIRE CO LTD (KR) 2020-09-30 EP claimed
US-5185405-A High molecular weight vinyl arene/acrylic ester copolymer polymerized using a diperoxy catalyst blended with a low molecular weight styrene/acrylic ester polymer; low fixing temperature; offset resistance SANYO CHEMICAL INDUSTRIES, LTD. (JP) 1993-02-09 US claimed
US-4134927-A EXTRUDING ETHYLENE COPOLYMER, UNSATURATED DICARBOXYLIC ACID, AND AN ALKYL PEROXIDE MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1979-01-16 US claimed
JP-55125155-A None JP disclosed
EP-3683208-B1 COMPOUND, COATING COMPOSITION COMPRISING SAME, AND ORGANIC LIGHT-EMITTING DEVICE LG CHEMICAL LTD (KR) 2026-03-25 EP disclosed
EP-3686186-B1 COMPOUND, COATING COMPOSITION COMPRISING SAME, AND ORGANIC LIGHT EMITTING DIODE LG CHEMICAL LTD (KR) 2026-03-04 EP disclosed
US-12544961-B2 Thermosetting composition for injection molding, method for producing molded article using the same, and cured product IDEMITSU KOSAN CO., LTD. (JP) 2026-02-10 US disclosed
EP-0157314-A1 Process for preparing copolymer KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-10-09 EP disclosed
US-4542164-A BROMINATED BISPHENOL A EPOXY RESIN, THEMOPLASTIC TORAY INDUSTRIES, INCORPORATED (JP) 1985-09-17 US disclosed
EP-0029169-B1 POLYMERS AND PROCESS FOR THEIR PREPARATION Agfa-Gevaert AG (DE) 1983-05-18 EP disclosed
JP-S55125155-A POLYMER COMPOSITION HAVING GOOD ADHESION PROPERTY TO BRASS YOKOHAMA RUBBER CO LTD:THE 1980-09-26 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12544961-B2 Thermosetting composition for injection molding, method for producing molded article using the same, and cured product MAT2B, MAT1A, MMAB DGKA 2265/4885ALDH1A1 2050/4885ATM 984/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.