SCHEMBL112008

SCHEMBL112008

C=C(C)C(=O)NCCCNCC

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 2/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
GLA P06280 1/20 0.46
CYP1A2 P05177 1/20 0.44
PAOX Q6QHF9 1/20 0.42
KDM4E B2RXH2 2/20 0.40
TSHR P16473 1/20 0.39
KDM1A O60341 4/20 0.39
SAT1 P21673 3/20 0.38
MAPK1 P28482 1/20 0.37
HIF1A Q16665 1/20 0.37
ACHE P22303 1/20 0.34
CA12 O43570 1/20 0.34
CA2 P00918 1/20 0.34
CA3 P07451 1/20 0.34
CA4 P22748 1/20 0.34
CA6 P23280 1/20 0.34
CA5A P35218 1/20 0.34
CA7 P43166 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL31441106 0.98 CYP2C19 (0.44) CYP2C19MEN1KMT2AGLACYP1A2
SCHEMBL110493 0.96 PAOX (0.47) CYP2C19MEN1KMT2AGLACYP1A2
SCHEMBL107894 0.94 PAOX (0.46) CYP2C19MEN1KMT2AGLACYP1A2
SCHEMBL111160 0.88 TGFBR1 (0.34) CYP2C19MEN1KMT2AGLACYP1A2
SCHEMBL632876 0.87 KDM4E (0.46) CYP2C19MEN1KMT2APAOXKDM4E
SCHEMBL3278941 0.86 PAOX (0.60) CYP2C19MEN1KMT2AGLACYP1A2
SCHEMBL2556382 0.86 PAOX (0.50) CYP2C19CYP1A2PAOXKDM4ETSHR
Diethylamine SCHEMBL2502248 0.86 ACHE (0.46) CYP2C19CYP1A2PAOXTSHRACHE
SCHEMBL16309325 0.85 KDM4E (0.44) CYP2C19MEN1KMT2APAOXKDM4E
SCHEMBL3280866 0.85 PAOX (0.53) PAOXTSHREPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 206 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US claimed
US-7700540-B2 Hard surface cleaning composition THE CLOROX COMPANY (US) 2010-04-20 US claimed
US-20070099816-A1 Hard Surface Cleaning Composition THE CLOROX COMPANY 2007-05-03 US claimed
EP-1720407-A1 FORMULATION FOR SEED TREATMENT COMPRISING POLYMERIC STICKERS BASF AKTIENGESELLSCHAFT (DE) 2006-11-15 EP claimed
WO-2005077170-A1 FORMULATION FOR SEED TREATMENT COMPRISING POLYMERIC STICKERS BASF AKTIENGESELLSCHAFT (DE) 2005-08-25 WO claimed
EP-3870656-B1 ACRYLIC POLYMERS FOR INKJET INK APPLICATIONS CABOT CORP (US) 2026-03-18 EP disclosed
US-12018162-B2 Acrylic polymers for inkjet ink applications CABOT CORPORATION (US) 2024-06-25 US disclosed
US-11976220-B2 Polishing composition and method for producing same FUJIMI INCORPORATED (JP) 2024-05-07 US disclosed
US-11913899-B2 Sensor using particles coated with molecularly imprinted polymer SHIBAURA INSTITUTE OF TECHNOLOGY (JP) 2024-02-27 US disclosed
EP-4067999-B1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
EP-4063954-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
US-20230073290-A1 POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME FUJIMI INCORPORATED (JP) 2023-03-09 US disclosed
US-4456633-A Chip seal technique employing blends of asphaltic emulsions OWENS-CORNING FIBERGLAS CORPORATION (US) 1984-06-26 US disclosed
US-4436864-A Aqueous emulsions of acrylamide and rubber modified asphalts OWENS-CORNING FIBERGLAS CORPORATION (US) 1984-03-13 US disclosed
US-4436767-A Slurry seal method using acrylamide and rubber modified asphaltic emulsion OWENS-CORNING FIBERGLAS CORPORATION (US) 1984-03-13 US disclosed
US-4419489-A Easily emulsifiable acrylamide and rubber modified asphalts OWENS-CORNING FIBERGLAS CORPORATION (US) 1983-12-06 US disclosed
US-4394481-A Cationic arcylamide and rubber modified asphalts OWENS-CORNING FIBERGLAS CORPORATION (US) 1983-07-19 US disclosed
WO-1983002115-A1 CATIONIC ACRYLAMIDE AND RUBBER MODIFIED ASPHALTS OWENS CORNING FIBERGLASS CORP (US) 1983-06-23 WO disclosed
EP-0082056-A1 Cationic acrylamide and rubber modified asphalts OWENS-CORNING FIBERGLAS CORPORATION (US) 1983-06-22 EP disclosed
US-4383081-A Cationic acrylamide chemically modified asphalts OWENS-CORNING FIBERGLAS CORPORATION (US) 1983-05-10 US disclosed