Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5532017 | 0.80 | ALDH1A1 (0.33) | — | |
| SCHEMBL10409680 | 0.78 | KDM4E (0.35) | — | |
| SCHEMBL10409668 | 0.76 | KDM4E (0.31) | — | |
| SCHEMBL10544238 | 0.76 | KDM4E (0.31) | — | |
| SCHEMBL30100572 | 0.76 | THRB (0.49) | THRB | |
| SCHEMBL1122086 | 0.76 | THRB (0.49) | THRB | |
| SCHEMBL5611550 | 0.75 | TSHR (0.34) | — | |
| SCHEMBL5612429 | 0.74 | HCAR2 (0.40) | — | |
| SCHEMBL7723169 | 0.71 | THRB (0.52) | THRB | |
| SCHEMBL9137535 | 0.71 | THRB (0.52) | THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3149076-B1 | POLYMER COMPOSITION AND HEAT-SHRINKABLE ARTICLE | TYCO ELECTRONICS LTD UK (GB) | 2018-03-14 | — | — | EP | claimed |
| US-12215246-B2 | Composition comprising a light-weight filler | HENKEL AG & CO. KGAA (DE) | 2025-02-04 | — | — | US | disclosed |
| US-20240132687-A1 | Thermally expandable compositions comprising wax | HENKEL AG & CO KGAA (DE) | 2024-04-25 | — | — | US | disclosed |
| EP-3421527-B1 | COMPOSITION CONTAINING A LIGHTWEIGHT FILLER | HENKEL AG & CO KGAA (DE) | 2023-11-15 | — | — | EP | disclosed |
| US-11578181-B2 | Thermally expandable compositions | HENKEL AG & CO. KGAA (DE) | 2023-02-14 | — | — | US | disclosed |
| WO-2023280561-A1 | THERMALLY EXPANDABLE COMPOSITIONS COMPRISING WAX | HENKEL AG & CO. KGAA (DE) | 2023-01-12 | — | — | WO | disclosed |
| EP-4116363-A1 | THERMALLY EXPANDABLE COMPOSITIONS COMPRISING WAX | Henkel AG & Co. KGaA (DE) | 2023-01-11 | — | — | EP | disclosed |
| EP-3147323-B2 | THERMALLY EXPANDABLE COMPOSITIONS WITH POLYSACCHARIDE | HENKEL AG & CO KGAA (DE) | 2022-12-28 | — | — | EP | disclosed |
| US-11441004-B2 | Thermally expandable compositions comprising polysaccharide | HENKEL AG & CO. KGAA (DE) | 2022-09-13 | — | — | US | disclosed |
| US-20220220319-A1 | THERMALLY EXPANDABLE PREPARATION | HENKEL AG & CO. KGAA (DE) | 2022-07-14 | — | — | US | disclosed |
| US-20080176969-A1 | THERMALLY EXPANDABLE MATERIAL USEFUL FOR REDUCING VIBRATIOIN TRANSFER | HENKEL KGAA (DE) | 2008-07-24 | — | — | US | disclosed |
| US-7364221-B2 | Reduction of vibration transfer | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2008-04-29 | — | — | US | disclosed |
| WO-2008034755-A1 | SOLID EXPANDABLE COMPOSITIONS | HENKEL AG & CO. KGAA (DE) | 2008-03-27 | — | — | WO | disclosed |
| WO-2007146726-A2 | CAVITY FILLER INSERT | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2007-12-21 | — | — | WO | disclosed |
| US-20070100060-A1 | Reduction of vibration transfer | HENKEL AG & CO. KGAA (DE) | 2007-05-03 | — | — | US | disclosed |
| EP-1772480-A1 | Reduction of transfer of vibrations | Henkel KGaA (DE) | 2007-04-11 | — | — | EP | disclosed |
| US-7198686-B2 | Foamable coupling for lamp assembly and methods for using the coupling | TYCO ELECTRONICS CORPORATION (US) | 2007-04-03 | — | — | US | disclosed |
| US-20040101651-A1 | Foamable coupling for lamp assembly and methods for using the coupling | TE CONNECTIVITY SOLUTIONS GMBH (CH) | 2004-05-27 | — | — | US | disclosed |
| US-6650033-B2 | Lamp assembly in which the foamable coupling securely affixes a light emitting glass lamp in a metal base, ethylene-vinyl acetate and other addition polymers | TYCO ELECTRONICS CORPORATION | 2003-11-18 | — | — | US | disclosed |
| US-20030034723-A1 | Foamable coupling for lamp assembly and methods for using the coupling | TE CONNECTIVITY SOLUTIONS GMBH (CH) | 2003-02-20 | — | — | US | disclosed |