⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1128512 | 0.91 | — | — | |
| SCHEMBL1128384 | 0.90 | — | — | |
| SCHEMBL1127692 | 0.86 | — | — | |
| SCHEMBL10476775 | 0.77 | MAOA (0.39) | — | |
| SCHEMBL9160477 | 0.77 | MAOA (0.39) | — | |
| SCHEMBL36333 | 0.77 | MAOA (0.39) | — | |
| SCHEMBL29750726 | 0.76 | DRD1 (0.36) | — | |
| SCHEMBL1614828 | 0.76 | TDP2 (0.38) | — | |
| Ammonia Solution, Strong SCHEMBL1871983 | 0.75 | MAOA (0.37) | — | |
| Hydrochloric Acid SCHEMBL585839 | 0.75 | MAOA (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 185 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4738010-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME | Toray Industries, Inc. (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-20260116071-A1 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD | CANON KK (JP) | 2026-04-30 | — | — | US | disclosed |
| EP-4696511-A1 | INK-JET RECORDING HEAD | Canon Kabushiki Kaisha (JP) | 2026-02-18 | — | — | EP | disclosed |
| US-20260042918-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LIQUID-REPELLENT ANTI-FOULING FILM, AND INKJET RECORDING HEAD | CANON KK (JP) | 2026-02-12 | — | — | US | disclosed |
| US-20260042917-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LIQUID-REPELLENT ANTI-FOULING FILM, AND INKJET RECORDING HEAD | CANON KK (JP) | 2026-02-12 | — | — | US | disclosed |
| US-20260042294-A1 | INK-JET RECORDING HEAD | CANON KK (JP) | 2026-02-12 | — | — | US | disclosed |
| EP-4692937-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER | Toray Industries, Inc. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4691782-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LIQUID-REPELLENT ANTI-FOULING FILM, AND INKJET RECORDING HEAD | Canon Kabushiki Kaisha (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4691783-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LIQUID-REPELLENT ANTI-FOULING FILM, AND INKJET RECORDING HEAD | CANON KABUSHIKI KAISHA (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4668018-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE | Toray Industries, Inc. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20100255417-A1 | RADIATION-CURABLE SILICONE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100119939-A1 | NEGATIVE ELECTRODE BASE MEMBER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| US-7709598-B2 | Fluorinated alkyl fluorophoshoric acid salts of onium and transition metal complex | SAN-APRO LIMITED (JP) | 2010-05-04 | — | — | US | disclosed |
| US-20100068649-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMATION METHOD USING THE SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-03-18 | — | — | US | disclosed |
| US-20100047715-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, CHEMICALLY AMPLIFIED DRY FILM FOR THICK FILM, AND METHOD FOR PRODUCTION OF THICK FILM RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-02-25 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20080311512-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PATTERN FORMING | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20080311511-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND METHOD FOR PATTERN FORMING | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20070225458-A1 | Novel Fluorinated Alkyl Fluorophosphoric Acid Salts of Onium and Ttransition Metal Complex | SAN-APRO LIMITED (JP) | 2007-09-27 | — | — | US | disclosed |
| EP-1752463-A1 | NOVEL FLUORINATED ALKYLFLUOROPHOSPHORIC ACID SALT OF ONIUM AND TRANSITION METAL COMPLEX | San-Apro Limited (JP) | 2007-02-14 | — | — | EP | disclosed |