SCHEMBL1142938

SCHEMBL1142938

CO[Si](OC)(OC)C(C)CNC(N)=O

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
BCAT2 O15382 1/20 0.34
CYP2D6 P10635 1/20 0.31
CYP2C19 P33261 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1142593 0.81 BCAT2 (0.33) BCAT2
SCHEMBL3158558 0.81 MTNR1A (0.33)
SCHEMBL1142904 0.78 CHRNB2 (0.34) BCAT2
SCHEMBL1143084 0.75 MAPT (0.36)
SCHEMBL27502330 0.72 L3MBTL1 (0.32) L3MBTL1
SCHEMBL15481501 0.71 CA14 (0.39) BCAT2CYP2D6CYP2C19L3MBTL1
SCHEMBL10056281 0.71 CA14 (0.39) BCAT2CYP2D6CYP2C19L3MBTL1
SCHEMBL10055155 0.71 CA14 (0.39) BCAT2CYP2D6CYP2C19L3MBTL1
SCHEMBL23863 0.71
SCHEMBL9722592 0.71 MTNR1A (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8765868-B2 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-07-01 US disclosed
US-20110027544-A1 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-02-03 US disclosed