SCHEMBL11622101

SCHEMBL11622101

Cc1cccc(-c2nc(O)c(O)n2C)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 3/20 0.43
L3MBTL1 Q9Y468 2/20 0.42
ALDH1A1 P00352 2/20 0.42
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
ACHE P22303 1/20 0.41
TDP2 O95551 1/20 0.40
TLR8 Q9NR97 1/20 0.40
CHRNB4 P30926 1/20 0.40
CHRNA3 P32297 1/20 0.40
NPC1 O15118 2/20 0.40
KDM4E B2RXH2 1/20 0.40
TRPM8 Q7Z2W7 1/20 0.39
LMNA P02545 1/20 0.39
KMO O15229 1/20 0.39
PIN1 Q13526 1/20 0.39
ADORA3 P0DMS8 1/20 0.39
ADORA2A P29274 1/20 0.39
ADORA2B P29275 1/20 0.39
ADORA1 P30542 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL33657 0.83 ATM (0.45) RAB9AALDH1A1MEN1KMT2ANPC1
SCHEMBL11620095 0.79 ALDH1A1 (0.42) RAB9AALDH1A1MEN1KMT2AACHE
SCHEMBL30785610 0.78 RAB9A (0.46) RAB9AL3MBTL1ALDH1A1MEN1KMT2A
SCHEMBL29171117 0.78 RAB9A (0.46) RAB9AL3MBTL1ALDH1A1MEN1KMT2A
SCHEMBL5200829 0.77 CYP1A2 (0.41) RAB9AALDH1A1NPC1KDM4ELMNA
SCHEMBL3627522 0.72 ATM (0.45) RAB9AALDH1A1MEN1KMT2ANPC1
Imidazole SCHEMBL9986414 0.70 ATM (0.41) RAB9AL3MBTL1ALDH1A1MEN1KMT2A
SCHEMBL23398666 0.70 JMJD6 (0.47) RAB9AL3MBTL1ALDH1A1KMT2AACHE
SCHEMBL15177867 0.70 MEN1 (0.63) RAB9AL3MBTL1ALDH1A1MEN1KMT2A
SCHEMBL11618177 0.69 PKM (0.45) RAB9AL3MBTL1ALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10875976-B2 Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same TOHO TENAX CO., LTD. (JP) 2020-12-29 US disclosed
EP-3075785-B1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME TOHO TENAX CO LTD (JP) 2019-09-11 EP disclosed
EP-3075785-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME Toho Tenax Co., Ltd. (JP) 2016-10-05 EP disclosed
US-20160280871-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME TOHO TENAX CO., LTD. (JP) 2016-09-29 US disclosed
US-4122277-A CURING AGENTS FOR EPOXIDES, DYEABILITY IMPROVERS, FORMALDEHYDE RESIN ADDITIVES, ION EXCHANGE RESINS SHIKOKU CHEMICALS CORPORATION (JP) 1978-10-24 US disclosed
US-4104473-A HYDROXYMETHYLATION WITH FORMALDEHYDE SHIKOKU CHEMICALS CORPORATION (JP) 1978-08-01 US disclosed