Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.44 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.44 |
| ▸ | ADORA2B | P29275 | 4/20 | 0.44 |
| ▸ | ADORA2A | P29274 | 3/20 | 0.44 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.43 |
| ▸ | DHODH | Q02127 | 1/20 | 0.43 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.42 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.42 |
| ▸ | PI4KA | P42356 | 1/20 | 0.42 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.42 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.42 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.42 |
| ▸ | PTGER1 | P34995 | 1/20 | 0.42 |
| ▸ | TLR7 | Q9NYK1 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5200829 | 0.93 | CYP1A2 (0.41) | ATMNPC1RAB9ANR1H2NR1H3 | |
| SCHEMBL3627522 | 0.88 | ATM (0.45) | ATMNPC1RAB9ANR1H2NR1H3 | |
| Quinoline SCHEMBL27756782 | 0.84 | ALDH1A1 (0.49) | ATMNPC1RAB9ANR1H2NR1H3 | |
| Imidazole SCHEMBL9986414 | 0.84 | ATM (0.41) | ATMNPC1RAB9ANR1H2NR1H3 | |
| SCHEMBL11620095 | 0.84 | ALDH1A1 (0.42) | NPC1RAB9AALOX5ALDH1A1MEN1 | |
| SCHEMBL719704 | 0.84 | CYP1A2 (0.46) | ATMNPC1RAB9ANR1H2NR1H3 | |
| SCHEMBL11622101 | 0.83 | RAB9A (0.43) | NPC1RAB9AADORA2BADORA2AADORA3 | |
| SCHEMBL5198933 | 0.80 | KDM4E (0.41) | ADORA2BADORA2AADORA3ADORA1ALDH1A1 | |
| SCHEMBL27837647 | 0.79 | CYP11B1 (0.38) | ATMNR1H2NR1H3ADORA2BADORA2A | |
| SCHEMBL11618177 | 0.77 | PKM (0.45) | NPC1RAB9AADORA2AADORA3ADORA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5594 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250163261-A1 | LOW-DIELECTRIC RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2025-05-22 | — | — | US | claimed |
| WO-2025035578-A1 | BUILD-UP ADHESIVE FILM FOR FLAME-RETARDANT FC-BGA PACKAGING SUBSTRATE, PREPARATION METHOD THEREFOR, AND USE THEREOF | 深圳市纽菲斯新材料科技有限公司 | 2025-02-20 | — | — | WO | claimed |
| WO-2025000813-A1 | ADDITIONAL ADHESIVE FILM FOR MULTI-COMPONENT FILLER FC-BGA PACKAGING CARRIER PLATE, AND PREPARATION METHOD THEREFOR AND USE THEREOF | 深圳市纽菲斯新材料科技有限公司 | 2025-01-02 | — | — | WO | claimed |
| US-20240199925-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO KGAA (DE) | 2024-06-20 | — | — | US | claimed |
| CN-118206718-A | Core-shell material and preparation method thereof | 华为技术有限公司 | 2024-06-18 | — | — | CN | claimed |
| US-20240165861-A1 | ENCAPSULATING RESIN COMPOSITION FOR INJECTION MOLDING | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-05-23 | — | — | US | claimed |
| CN-117777654-A | Raw material composition for preparing epoxy plastic package material, and preparation method and application thereof | 江苏中科科化新材料股份有限公司 | 2024-03-29 | — | — | CN | claimed |
| CN-117727527-A | Magnetic semi-fluid composition and inductor | 深圳市优宝新材料科技有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-117701208-A | Adhesive for semiconductor, adhesive sheet for semiconductor, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-03-15 | — | — | CN | claimed |
| CN-117487315-A | Epoxy resin composition | 昆山兴凯半导体材料有限公司 | 2024-02-02 | — | — | CN | claimed |
| WO-1992008073-A1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | RAYCHEM CORPORATION (US) | 1992-05-14 | — | — | WO | claimed |
| US-5043102-A | Blend of epoxy resin, unsaturated monomer, free radical catalyst, and silver particles | ADVANCED PRODUCTS, INC. (US) | 1991-08-27 | — | — | US | claimed |
| WO-1991008575-A1 | CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE | ADVANCED PRODUCTS, INC. (US) | 1991-06-13 | — | — | WO | claimed |
| US-4942190-A | EPOXY RESIN, DICYANDIAMIDE AS A SETTING AGENT, A PHENOXY RESIN, AND AN IMIDAZOLE PROMOTER | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1990-07-17 | — | — | US | claimed |
| US-4689388-A | POLYHYDRAZIDE, LATENT CURING AGENT, DICYANDIAMIDE, IMIDAZOLE OR DERIVATIVE | AJINOMOTO CO., INC. (JP) | 1987-08-25 | — | — | US | claimed |
| EP-0033295-B1 | INSULATING TAPE FOR THE MANUFACTURE OF AN INSULATING JACKET FOR ELECTRIC CONDUCTORS IMPREGNATED WITH A THERMOSETTING CURING MIXTURE OF EPOXY RESIN AND ACID ANHYDRIDE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1987-07-15 | — | — | EP | claimed |
| US-4663190-A | CURING EPOXY RESIN, DIBASIC ACID, IMIDAZOLE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1987-05-05 | — | — | US | claimed |
| US-4658009-A | Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-04-14 | — | — | US | claimed |
| US-4478906-A | Impregnated insulating tape for fabricating an insulating sleeve for electric conductors | SIEMENS AKTIENGESELLSCHAFT (DE) | 1984-10-23 | — | — | US | claimed |
| US-4336302-A | SAID TAPE CONTAINING MICA IN A BINDER CONTAINING A QUATERNARY ONIUM SALT HARDEINING ACCELERATOR | SIEMENS AKTIENGESELLSCHAFT (DE) | 1982-06-22 | — | — | US | claimed |