Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.31 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.31 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11918796 | 0.87 | KMT2A (0.33) | MEN1MAPK1KMT2ATSHRALDH1A1 | |
| SCHEMBL1217993 | 0.86 | HSD11B1 (0.34) | — | |
| SCHEMBL677951 | 0.82 | MEN1 (0.36) | MEN1MAPK1KMT2AALDH1A1EPHX1 | |
| SCHEMBL15281488 | 0.82 | CYP17A1 (0.36) | MEN1MAPK1KMT2AALDH1A1EPHX1 | |
| SCHEMBL172055 | 0.82 | CYP17A1 (0.36) | MEN1MAPK1KMT2AALDH1A1EPHX1 | |
| SCHEMBL1215493 | 0.81 | — | — | |
| SCHEMBL5969194 | 0.78 | MEN1 (0.33) | MEN1MAPK1KMT2ATSHRALDH1A1 | |
| SCHEMBL24908658 | 0.77 | ALDH1A1 (0.33) | MEN1MAPK1KMT2AALDH1A1CYP17A1 | |
| SCHEMBL1143635 | 0.77 | EPHX2 (0.35) | MEN1MAPK1KMT2AALDH1A1CYP17A1 | |
| SCHEMBL85662 | 0.77 | MEN1 (0.33) | MEN1MAPK1KMT2ACYP17A1CYP19A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12032290-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| US-11835849-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2023-12-05 | — | — | US | disclosed |
| US-11697754-B2 | Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-07-11 | — | — | US | disclosed |
| US-11697754-B2 | Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-07-11 | — | — | US | disclosed |
| US-11687001-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2023-06-27 | — | — | US | disclosed |
| US-20230194983-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| US-20230161249-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND | FUJIFILM CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| US-20230161249-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND | FUJIFILM CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| US-11333978-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing solid-state imaging element | FUJIFILM CORPORATION (JP) | 2022-05-17 | — | — | US | disclosed |
| US-11156917-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2021-10-26 | — | — | US | disclosed |
| US-20050014087-A1 | Photoresist polymeric compound and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-6806335-B2 | FOR USE IN FINE PATTERNING OF SEMICONDUCTORS | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-10-19 | — | — | US | disclosed |
| US-6692889-B1 | COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-02-17 | — | — | US | disclosed |
| US-20040006189-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. | 2004-01-08 | — | — | US | disclosed |
| EP-1354897-A1 | POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR | Daicel Chemical Industries, Ltd. (JP) | 2003-10-22 | — | — | EP | disclosed |
| US-20030148210-A1 | Polymer for photoresist and resin compositions therefor | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-08-07 | — | — | US | disclosed |
| US-6552143-B2 | Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-04-22 | — | — | US | disclosed |
| US-20020169266-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2002-11-14 | — | — | US | disclosed |
| EP-1172694-A1 | POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
| EP-1172384-A1 | POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030148210-A1 | Polymer for photoresist and resin compositions therefor | LCP1, DOT1L, PRMT1 | MEN1 2377/4885MAPK1 1466/4885KMT2A 251/4885 |
| US-11835849-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | RER1, TERB1, TRRAP | MEN1 1509/4885MAPK1 3497/4885KMT2A 1724/4885 |
| US-20230194983-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | RER1, TERB1, TRRAP | MEN1 1515/4885MAPK1 3443/4885KMT2A 1751/4885 |
| US-11687001-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | RER1, TERB1, TRRAP | MEN1 1509/4885MAPK1 3497/4885KMT2A 1724/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.