Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | DPP4 | P27487 | 2/20 | 0.32 |
| ▸ | ABL1 | P00519 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | RIN1 | Q13671 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1217743 | 0.88 | — | — | |
| SCHEMBL1143209 | 0.86 | EPHX2 (0.33) | ALDH1A1TSHRL3MBTL1 | |
| SCHEMBL1216441 | 0.86 | HSD11B1 (0.34) | HSD11B1ALDH1A1DPP4PKM | |
| SCHEMBL678282 | 0.82 | PKM (0.33) | HSD11B1ALDH1A1DPP4ABL1TSHR | |
| SCHEMBL5411822 | 0.82 | HSD11B1 (0.35) | HSD11B1ALDH1A1NPSR1DPP4ABL1 | |
| SCHEMBL25561387 | 0.80 | ALDH1A1 (0.30) | ALDH1A1 | |
| SCHEMBL1217993 | 0.79 | HSD11B1 (0.34) | HSD11B1DPP4PKML3MBTL1 | |
| SCHEMBL17530084 | 0.78 | ALDH1A1 (0.41) | HSD11B1ALDH1A1NPSR1ABL1TSHR | |
| SCHEMBL5900935 | 0.77 | EPHX2 (0.31) | ALDH1A1 | |
| SCHEMBL1218624 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1354897-B1 | POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR | DAICEL CHEM (JP) | 2012-10-24 | — | — | EP | disclosed |
| US-20110040056-A1 | PROCESS FOR PRODUCTION OF POLYMER | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2011-02-17 | — | — | US | disclosed |
| EP-1676869-B1 | PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION | DAICEL CHEM (JP) | 2009-10-14 | — | — | EP | disclosed |
| US-7407733-B2 | Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.04,8] nonan-3-one ring and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2008-08-05 | — | — | US | disclosed |
| US-20060281022-A1 | Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.0 4.8] nonan-3-one ring and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-12-14 | — | — | US | disclosed |
| US-7105268-B2 | Polymer for photoresist and resin compositions therefor | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| EP-1681307-A1 | POLYMERIC COMPOUND CONTAINING REPEATING UNIT HAVING 2-OXATRICYCLO[4.2.1.04,8]NONAN-3-ONE RING, AND PHOTORESIST RESIN COMPOSITION | Daicel Chemical Industries, Ltd. (JP) | 2006-07-19 | — | — | EP | disclosed |
| EP-1676869-A1 | PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION | Daicel Chemical Industries, Ltd. (JP) | 2006-07-05 | — | — | EP | disclosed |
| US-7033726-B2 | Photoresist polymeric compound and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-04-25 | — | — | US | disclosed |
| US-20050238990-A1 | Photoresist resin and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-10-27 | — | — | US | disclosed |
| US-20050014087-A1 | Photoresist polymeric compound and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-6806335-B2 | FOR USE IN FINE PATTERNING OF SEMICONDUCTORS | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-10-19 | — | — | US | disclosed |
| US-6692889-B1 | COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-02-17 | — | — | US | disclosed |
| US-20040006189-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. | 2004-01-08 | — | — | US | disclosed |
| EP-1354897-A1 | POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR | Daicel Chemical Industries, Ltd. (JP) | 2003-10-22 | — | — | EP | disclosed |
| US-20030148210-A1 | Polymer for photoresist and resin compositions therefor | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-08-07 | — | — | US | disclosed |
| US-6552143-B2 | Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-04-22 | — | — | US | disclosed |
| US-20020169266-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2002-11-14 | — | — | US | disclosed |
| EP-1172694-A1 | POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
| EP-1172384-A1 | POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030148210-A1 | Polymer for photoresist and resin compositions therefor | LCP1, DOT1L, PRMT1 | HSD11B1 2935/4885ALDH1A1 1006/4885NPSR1 2057/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.