SCHEMBL1224930

SCHEMBL1224930

CO[Si](OC)(OC)c1cccc(CC#N)c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 1/20 0.45
MMP3 P08254 2/20 0.42
KDM4E B2RXH2 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
PTGDR Q13258 1/20 0.36
ACP1 P24666 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
PTK2 Q05397 1/20 0.36
FFAR1 O14842 1/20 0.35
DRD2 P14416 1/20 0.35
DRD3 P35462 1/20 0.35
BRD4 O60885 1/20 0.34
CREBBP Q92793 1/20 0.34
PIK3CG P48736 2/20 0.34
TGFBR1 P36897 1/20 0.33
PIK3CD O00329 1/20 0.33
ABL1 P00519 1/20 0.33
EGFR P00533 1/20 0.33
HCK P08631 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29702759 0.80 ENPP2 (0.49) ENPP2MMP3KDM4ETDP1MEN1
SCHEMBL7163026 0.80 ENPP2 (0.49) ENPP2MMP3KDM4ETDP1MEN1
SCHEMBL3106769 0.78 TP53 (0.39) KDM4E
SCHEMBL27608831 0.77 LOXL2 (0.46) ENPP2
SCHEMBL3861937 0.77 TSHR (0.42)
SCHEMBL1223918 0.75 TAAR1 (0.37)
SCHEMBL237972 0.74 ENPP2 (0.63) ENPP2MMP3KDM4ETDP1MEN1
SCHEMBL574627 0.74 ACHE (0.32) KDM4E
SCHEMBL101334 0.73 TAAR1 (0.55) ENPP2
Benzene SCHEMBL5438521 0.72 ENPP2 (0.61) ENPP2MMP3KDM4ETDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116102734-B Phosphorus-nitrogen-containing cage polysilsesquioxane, preparation method thereof and application thereof as crusting and carbonizing agent 广州硅碳新材料有限公司 2023-10-24 CN claimed
CN-116102734-A Phosphorus-nitrogen-containing cage polysilsesquioxane, preparation method thereof and application thereof as crusting and carbonizing agent 广州硅碳新材料有限公司 2023-05-12 CN claimed
CN-116102734-B Phosphorus-nitrogen-containing cage polysilsesquioxane, preparation method thereof and application thereof as crusting and carbonizing agent 广州硅碳新材料有限公司 2023-10-24 CN disclosed
CN-116102734-A Phosphorus-nitrogen-containing cage polysilsesquioxane, preparation method thereof and application thereof as crusting and carbonizing agent 广州硅碳新材料有限公司 2023-05-12 CN disclosed
CN-111819249-A Curable composition, cured product, method for producing cured product, and method for using curable composition 琳得科株式会社 2020-10-23 CN disclosed
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
WO-2019176828-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION リンテック株式会社 2019-09-19 WO disclosed
US-10370498-B2 Curable polysilsesquioxane compound, production method thereof, curable composition, cured product and use method of curable composition LINTEC CORPORATION (JP) 2019-08-06 US disclosed
US-10266734-B2 Curable composition, cured product, method for using curable composition, and optical device LINTEC CORPORATION (JP) 2019-04-23 US disclosed
EP-3187547-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2018-12-05 EP disclosed
US-9359533-B2 Curable composition, cured product, and method for using curable composition LINTEC CORPORATION (JP) 2016-06-07 US disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
US-20150065663-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORPORATION (JP) 2015-03-05 US disclosed
EP-2829579-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2015-01-28 EP disclosed
US-8507044-B2 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device LINTEC CORPORATION (JP) 2013-08-13 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed