SCHEMBL12268536

SCHEMBL12268536

CC(=O)c1ccc(OC(=O)c2ccc3cc(OC(=O)c4ccc5cc(C(=O)O)ccc5c4)ccc3c2)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.58
KMT2A Q03164 8/20 0.53
MAPT P10636 4/20 0.53
TDP1 Q9NUW8 3/20 0.53
MEN1 O00255 3/20 0.53
HGFAC Q04756 1/20 0.49
POLB P06746 2/20 0.47
HSD17B10 Q99714 1/20 0.46
RAB9A P51151 2/20 0.46
HPGD P15428 1/20 0.46
GLA P06280 1/20 0.46
TSHR P16473 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.45
ESR1 P03372 1/20 0.45
NPSR1 Q6W5P4 1/20 0.44
NPC1 O15118 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
RXFP1 Q9HBX9 1/20 0.44
CASP3 P42574 1/20 0.44
SENP8 Q96LD8 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5698842 0.90 KDM4E (0.65) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL12268652 0.89 MAPT (0.51) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL15462343 0.89 MAPT (0.51) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL12895866 0.87 MAPT (0.55) KMT2AMAPTTDP1MEN1HGFAC
SCHEMBL6052888 0.87 KMT2A (0.68) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL12268648 0.86 KMT2A (0.60) KMT2AMAPTTDP1MEN1HGFAC
SCHEMBL2742859 0.86 KMT2A (0.64) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL5698841 0.85 KMT2A (0.66) KDM4EKMT2AMAPTTDP1MEN1
SCHEMBL12268693 0.85 HGFAC (0.50) KMT2AMAPTTDP1MEN1HGFAC
SCHEMBL4326711 0.84 MAPT (0.60) KDM4EKMT2AMAPTTDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8784682-B2 Thermosetting composition and printed circuit board using the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-22 US disclosed
US-20110235292-A1 THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-09-29 US disclosed