SCHEMBL12268652

SCHEMBL12268652

CC(=O)Oc1ccc2cc(C(=O)Oc3ccc4cc(C(=O)Oc5ccc(C(C)=O)cc5)ccc4c3)ccc2c1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 7/20 0.51
TDP1 Q9NUW8 4/20 0.51
KMT2A Q03164 7/20 0.50
MEN1 O00255 3/20 0.50
HGFAC Q04756 2/20 0.50
ELANE P08246 1/20 0.49
CA12 O43570 2/20 0.48
CA9 Q16790 2/20 0.48
HSD17B10 Q99714 1/20 0.47
HPGD P15428 1/20 0.47
RAB9A P51151 1/20 0.47
GLA P06280 2/20 0.47
TSHR P16473 1/20 0.47
POLB P06746 3/20 0.46
LMNA P02545 3/20 0.46
ESR1 P03372 1/20 0.46
KDM4E B2RXH2 2/20 0.45
GAA P10253 1/20 0.45
TTR P02766 1/20 0.45
TP53 P04637 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15462343 1.00 MAPT (0.51) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL24517581 0.90 KMT2A (0.61) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL12268536 0.89 KDM4E (0.58) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL12895866 0.88 MAPT (0.55) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL12268640 0.88 CA12 (0.54) MAPTTDP1KMT2AMEN1ELANE
SCHEMBL12268648 0.88 KMT2A (0.60) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL2742859 0.87 KMT2A (0.64) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL12268693 0.86 HGFAC (0.50) MAPTTDP1KMT2AMEN1HGFAC
SCHEMBL4326711 0.85 MAPT (0.60) MAPTTDP1KMT2AMEN1HPGD
SCHEMBL8081667 0.84 KMT2A (0.58) MAPTTDP1KMT2AMEN1ELANE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8784682-B2 Thermosetting composition and printed circuit board using the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-22 US disclosed
US-20110235292-A1 THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-09-29 US disclosed