SCHEMBL1244629

SCHEMBL1244629

CC(C)c1cc(OCC2CO2)c(C(C)C)cc1OCC1CO1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.51
GLA P06280 1/20 0.51
TSHR P16473 4/20 0.46
TP53 P04637 3/20 0.46
HIF1A Q16665 3/20 0.46
SMN1; SMN2 Q16637 3/20 0.46
CYP3A4 P08684 1/20 0.46
TDP1 Q9NUW8 1/20 0.43
MAPT P10636 2/20 0.41
HPGD P15428 2/20 0.41
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
CYP1A2 P05177 2/20 0.41
PPARG P37231 1/20 0.41
PKM P14618 3/20 0.38
GAA P10253 2/20 0.38
LMNA P02545 2/20 0.38
HRH3 Q9Y5N1 1/20 0.38
PTPN1 P18031 1/20 0.37
ADRA1A P35348 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21990717 0.91 ALDH1A1 (0.44) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL20678995 0.85 ALDH1A1 (0.45) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL8373583 0.84 ALDH1A1 (0.47) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL23731175 0.84 ALDH1A1 (0.47) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL13033300 0.84 ALDH1A1 (0.51) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL17900843 0.84 ALDH1A1 (0.51) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL20258080 0.82 ALDH1A1 (0.46) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL2718922 0.82 ALDH1A1 (0.48) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL4897371 0.81 ALDH1A1 (0.65) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL25246542 0.80 TSHR (0.56) ALDH1A1GLATSHRTP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630668-B2 Liquid compression molding material NAMICS CORPORATION (JP) 2026-05-19 US disclosed
US-20250026920-A1 LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL FOR TSV SK Hynix Inc. (KR) 2025-01-23 US disclosed
CN-113056519-B Curable resin composition and curable sheet 长濑化成株式会社 2024-02-23 CN disclosed
US-11760870-B2 Resin composition for encapsulation NAGASE CHEMTEX CORPORATION (JP) 2023-09-19 US disclosed
US-11718770-B2 Curable resin composition and curable sheet NAGASE CHEMTEX CORPORATION (JP) 2023-08-08 US disclosed
US-20230203236-A1 LIQUID COMPRESSION MOLDING MATERIAL NAMICS CORPORATION (JP) 2023-06-29 US disclosed
CN-115668484-A Liquid compression molding material 纳美仕有限公司 2023-01-31 CN disclosed
WO-2021261064-A1 LIQUID COMPRESSION MOLDING MATERIAL ナミックス株式会社 2021-12-30 WO disclosed
US-20210403765-A1 CURABLE RESIN COMPOSITION AND CURABLE SHEET NAGASE CHEMTEX CORPORATION (JP) 2021-12-30 US disclosed
CN-113056519-A Curable resin composition and curable sheet 长濑化成株式会社 2021-06-29 CN disclosed
US-8394512-B2 Phosphaphenanthrene compounds and organic light emitting diode using the same INKTEC CO., LTD. (KR) 2013-03-12 US disclosed
US-8394512-B2 Phosphaphenanthrene compounds and organic light emitting diode using the same INKTEC CO., LTD. (KR) 2013-03-12 US disclosed
US-20110105646-A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART NAGASE CHEMTEX CORPORATION (JP) 2011-05-05 US disclosed
EP-2280044-A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART Nagase ChemteX Corporation (JP) 2011-02-02 EP disclosed
US-20100252818-A1 PHOSPHAPHENANTHRENE COMPOUNDS AND ORGANIC LIGHT EMITTING DIODE USING THE SAME INKTEC CO., LTD. (KR) 2010-10-07 US disclosed
US-20100252818-A1 PHOSPHAPHENANTHRENE COMPOUNDS AND ORGANIC LIGHT EMITTING DIODE USING THE SAME INKTEC CO., LTD. (KR) 2010-10-07 US disclosed
EP-1806376-B1 HEAT-RESISTANT COMPOSITE MATERIAL NAGASE CHEMTEX CORP (JP) 2009-05-13 EP disclosed
US-20080139698-A1 Heat-Resistant Composite Material NAGASE CHEMTEX CORPORATION (JP) 2008-06-12 US disclosed
US-20080139758-A1 Epoxy monomers and/or resins and alkali metal salt of weak acid initiator; curing agent free; high polymerization rate and degree; low hygroscopicity thermoplastic polymers; strength, toughness, heat resistance NAGASE CHEMTEX CORPORATION (JP) 2008-06-12 US disclosed
EP-1806376-A1 HEAT-RESISTANT COMPOSITE MATERIAL Nagase Chemtex Corporation (JP) 2007-07-11 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100252818-A1 PHOSPHAPHENANTHRENE COMPOUNDS AND ORGANIC LIGHT EMITTING DIODE USING THE SAME DDT, PPOX, ODC1 ALDH1A1 923/4885GLA 3357/4885TSHR 2109/4885
US-12630668-B2 Liquid compression molding material PIEZO1, TSNAX, TMCO1 ALDH1A1 3204/4885GLA 3652/4885TSHR 1046/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.