Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | RPS6KA3 | P51812 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | NT5E | P21589 | 1/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | RECQL | P46063 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | PHLPP2 | Q6ZVD8 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 6/20 | 0.35 |
| ▸ | CA1 | P00915 | 5/20 | 0.35 |
| ▸ | CA9 | Q16790 | 5/20 | 0.35 |
| ▸ | CA7 | P43166 | 2/20 | 0.35 |
| ▸ | PTGS2 | P35354 | 5/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1867505 | 1.00 | POLB (0.44) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL1247146 | 0.77 | POLB (0.42) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL4651022 | 0.73 | TDP1 (0.52) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL2447623 | 0.72 | CYP2D6 (0.52) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL23644537 | 0.72 | MAPT (0.43) | CYP2D6LMNATDP1ALDH1A1NPC1 | |
| Butanal SCHEMBL28571294 | 0.70 | ALDH1A1 (0.44) | POLBCYP2D6LMNATDP1TSHR | |
| SCHEMBL1807437 | 0.69 | POLB (0.57) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL28560987 | 0.68 | POLB (0.83) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL18624977 | 0.68 | POLB (0.83) | POLBCYP2D6LMNATDP1RPS6KA3 | |
| SCHEMBL23644553 | 0.68 | NOS1 (0.43) | CYP2D6LMNAALDH1A1RAB9AMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12519071-B2 | Structure containing Sn layer or Sn alloy layer | ISHIHARA CHEMICAL CO., LTD. (JP) | 2026-01-06 | — | — | US | disclosed |
| EP-3238861-B1 | SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL | SENJU METAL INDUSTRY CO (JP) | 2025-08-27 | — | — | EP | disclosed |
| US-12388035-B2 | Structure comprising under barrier metal and solder layer, and method for producing structure | ISHIHARA CHEMICAL CO., LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| EP-4582596-A1 | PLATING SOLUTION | JCU Corporation (JP) | 2025-07-09 | — | — | EP | disclosed |
| US-20250179676-A1 | PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND | JCU CORPORATION (JP) | 2025-06-05 | — | — | US | disclosed |
| EP-4488421-A1 | PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND | JCU Corporation (JP) | 2025-01-08 | — | — | EP | disclosed |
| US-20240258255-A1 | STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METHOD FOR PRODUCING STRUCTURE | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-08-01 | — | — | US | disclosed |
| EP-4350748-A1 | STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METHOD FOR PRODUCING STRUCTURE | Ishihara Chemical Co., Ltd (JP) | 2024-04-10 | — | — | EP | disclosed |
| US-11939691-B2 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-03-26 | — | — | US | disclosed |
| WO-2024048039-A1 | PLATING SOLUTION | 株式会社JCU | 2024-03-07 | — | — | WO | disclosed |
| US-20050042868-A1 | METHOD FOR FORMING PLATING FILM | SHARP KABUSHIKI KAISHA (JP) | 2005-02-24 | — | — | US | disclosed |
| US-6811672-B2 | PLATING FILM ONTO AN OBJECT AT A FIRST CURRENT DENSITY IN A PLATING BATH HAVING A CATHODE CAPABLE OF VARYING CURRENT AND AN ANODE AND; AND MAINTAINING THE OBJECT TO BE PLATED AT A SECOND CURRENT DENSITY LOWER THAN THE FIRST CURRENT DENSITY. | SHARP KABUSHIKI KAISHA (JP) | 2004-11-02 | — | — | US | disclosed |
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |
| US-6544398-B2 | For forming gold-tin alloy plating film; brightness; electronics | ISHIHARA CHEMICAL CO., LTD (JP) | 2003-04-08 | — | — | US | disclosed |
| US-20030003320-A1 | Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. | KOBE LEADMIKK CO., LTD. (JP) | 2003-01-02 | — | — | US | disclosed |
| US-20020063063-A1 | Non-cyanide-type gold-tin alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2002-05-30 | — | — | US | disclosed |
| EP-0192273-B1 | TIN, LEAD, OR TIN-LEAD ALLOY PLATING BATH | Obata, Keigo (JP) | 1989-04-26 | — | — | EP | disclosed |
| US-4673470-A | CONTAINING ALKALI METAL SALT OF AN ALIPHATIC OR AROMATIC SULF OCARBOXYLIC ACID | Obata, Keigo (JP) | 1987-06-16 | — | — | US | disclosed |
| US-4555314-A | AN ALKANESULFONIC OR ALKANOLSULFONIC ACID AND A GUANAMINE COMPOUND | OBATA, DOHI, DAIWA FINE CHEMICALS CO. LTD. (JP) | 1985-11-26 | — | — | US | disclosed |
| US-4459185-A | SURFACTANT, LEVELING AGENTS | OBATA, DONI, DAIWA, FINE CHEMICALS CO., LTD. (JP) | 1984-07-10 | — | — | US | disclosed |