Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | ATM | Q13315 | 1/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | FAAH | O00519 | 5/20 | 0.39 |
| ▸ | CNR1 | P21554 | 1/20 | 0.39 |
| ▸ | CNR2 | P34972 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 5/20 | 0.39 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 3/20 | 0.36 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2945931 | 0.94 | FAAH (0.45) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL28226286 | 0.91 | LMNA (0.52) | ALDH1A1LMNACYP3A4TSHRATM | |
| SCHEMBL8761882 | 0.85 | LMNA (0.55) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL21711304 | 0.85 | LMNA (0.55) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL11068862 | 0.85 | LMNA (0.55) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL28891600 | 0.82 | ALDH1A1 (0.46) | ALDH1A1LMNACYP3A4TSHRATM | |
| SCHEMBL7954840 | 0.81 | FFAR4 (0.49) | ALDH1A1TSHRTDP1FAAHCNR1 | |
| SCHEMBL7954272 | 0.81 | FFAR4 (0.49) | ALDH1A1TSHRTDP1FAAHCNR1 | |
| SCHEMBL7954263 | 0.81 | FFAR4 (0.49) | ALDH1A1TSHRTDP1FAAHCNR1 | |
| SCHEMBL7954243 | 0.81 | FFAR4 (0.49) | ALDH1A1TSHRTDP1FAAHCNR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8974705-B2 | Sinterable silver flake adhesive for use in electronics | HENKEL AG & CO. KGAA (DE) | 2015-03-10 | — | — | US | claimed |
| US-20130187102-A1 | SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS | HENKEL CORPORATION (US) | 2013-07-25 | — | — | US | claimed |
| WO-2012115704-A1 | SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS | HENKEL AG & CO. KGAA (DE) | 2012-08-30 | — | — | WO | claimed |
| US-20230174773-A1 | CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING | HENKEL AG & CO. KGAA (DE) | 2023-06-08 | — | — | US | disclosed |
| EP-2891159-B1 | SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION | Henkel IP & Holding GmbH (DE) | 2022-07-20 | — | — | EP | disclosed |
| WO-2022011494-A1 | CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING | HENKEL AG & CO. KGAA (DE) | 2022-01-20 | — | — | WO | disclosed |
| US-10000670-B2 | Silver sintering compositions with fluxing or reducing agents for metal adhesion | Henkel IP & Holding GmbH (DE) | 2018-06-19 | — | — | US | disclosed |
| EP-2891159-A1 | SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION | Henkel US IP LLC (US) | 2015-07-08 | — | — | EP | disclosed |
| US-8974705-B2 | Sinterable silver flake adhesive for use in electronics | HENKEL AG & CO. KGAA (DE) | 2015-03-10 | — | — | US | disclosed |
| WO-2014022284-A1 | SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION | Henkel US IP LLC (US) | 2014-02-06 | — | — | WO | disclosed |
| US-20140030509-A1 | SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION | HENKEL CORPORATION (US) | 2014-01-30 | — | — | US | disclosed |
| US-20130187102-A1 | SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS | HENKEL CORPORATION (US) | 2013-07-25 | — | — | US | disclosed |
| WO-2012115704-A1 | SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS | HENKEL AG & CO. KGAA (DE) | 2012-08-30 | — | — | WO | disclosed |