Sulfuric Acid

Sulfuric Acid

SCHEMBL124985

Nc1ncncn1.O=S(=O)(O)O

nearest known ligand 0.68

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSP90AA1 P07900 3/20 0.68
KDM4E B2RXH2 2/20 0.35
HDAC1 Q13547 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
ALDH1A1 P00352 2/20 0.32
TSHR P16473 2/20 0.32
NT5E P21589 1/20 0.32
CA5A P35218 1/20 0.32
CA5B Q9Y2D0 1/20 0.32
PIK3CB P42338 1/20 0.32
MEN1 O00255 1/20 0.31
GAA P10253 1/20 0.31
MAPT P10636 1/20 0.31
PKM P14618 1/20 0.31
RAB9A P51151 1/20 0.31
KMT2A Q03164 1/20 0.31
CYP3A4 P08684 1/20 0.31
THRB P10828 1/20 0.31
HPGD P15428 1/20 0.31
ALOX15 P16050 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfamate SCHEMBL8843758 0.92 HSP90AA1 (0.65) HSP90AA1KDM4EHDAC1HDAC6ALDH1A1
SCHEMBL28268009 0.90 HSP90AA1 (0.62) HSP90AA1KDM4EHDAC1HDAC6ALDH1A1
SCHEMBL28293480 0.84 ALDH1A1 (0.56) HSP90AA1KDM4EALDH1A1TSHRNT5E
SCHEMBL4458 0.83
Formaldehyde SCHEMBL3745731 0.80
Hydrochloric Acid SCHEMBL360708 0.80
Water SCHEMBL4239659 0.80 HSP90AA1 (0.93) HSP90AA1KDM4ECYP3A4
SCHEMBL854885 0.80
Water SCHEMBL6705186 0.80
SCHEMBL28210447 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 224 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1976994-B Flame retardant resin composition and molded article TECHNO POLYMER CO LTD 2010-05-26 CN claimed
US-7553899-B2 Flame retardant resin composition and molded article TECHNO POLYMER CO., LTD. (JP) 2009-06-30 US claimed
US-20070208114-A1 Flame Retardant Resin Composition and Molded Article TECHNO POLYMER CO., LTD. (JP) 2007-09-06 US claimed
CN-1976994-A Flame retardant resin composition and molded article TECHNO POLYMER CO LTD (JP) 2007-06-06 CN claimed
JP-9132693-A None JP disclosed
EP-4685172-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685185-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND CURABLE COMPOUND DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685171-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
US-20250320180-A1 HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT DIC CORPORATION (JP) 2025-10-16 US disclosed
US-20250277081-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DIC CORPORATION (JP) 2025-09-04 US disclosed
US-20250277080-A1 PHENOLIC HYDROXY GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC CORPORATION (JP) 2025-09-04 US disclosed
EP-4585594-A1 GLYCIDYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC Corporation (JP) 2025-07-16 EP disclosed
US-6660811-B2 Curing agent and oligomers or polymers derived from the reaction product of an aromatic aldehyde and a phenolic compound, with the phenolic hydroxyl groups converted to glycidyloxy groups; semiconductor, electronic sealants DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-12-09 US disclosed
JP-2003272451-A FLAT CABLE SHEATHING AND FLAT CABLE DAINIPPON PRINTING CO LTD 2003-09-26 JP disclosed
EP-0974588-B1 1,3,5-TRIAZINE DERIVATIVE SALTS OF POLYACIDS COMPRISING PHOSPHORUS, SULFUR, AND OXYGEN AND PROCESS FOR PRODUCING THE SAME NISSAN CHEMICAL IND LTD (JP) 2003-05-14 EP disclosed
US-20020156189-A1 Epoxy resin composition and curing product therof DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-10-24 US disclosed
US-6121445-A MIXING MELAMINE, PHOSPHORIC ACID AND SULFURIC ACID AT A TEMPERATURE OF FROM 0 TO 330 DEGREES C IN SUCH RATIOS THAT THE MELAMINE IS FROM 1.0 TO 4.0 MOLS PER MOL OF THE TOTAL MOLAR AMOUNT OF THE PHOSPHORIC ACID, BAKING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2000-09-19 US disclosed
EP-0974588-A1 1,3,5-TRIAZINE DERIVATIVE SALTS OF POLYACIDS COMPRISING PHOSPHORUS, SULFUR, AND OXYGEN AND PROCESS FOR PRODUCING THE SAME Nissan Chemical Industries, Ltd. (JP) 2000-01-26 EP disclosed
JP-H09132693-A FLAME-RETARDANT RESIN COMPOSITION NIPPON STEEL CHEM CO LTD 1997-05-20 JP disclosed
WO-1997004028-A1 FLAME-RETARDANT RESIN COMPOSITION NIPPON STEEL CHEMICAL CO., LTD. (JP) 1997-02-06 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250320180-A1 HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT RAD51, SEM1, GFER HSP90AA1 140/4885KDM4E 756/4885HDAC1 2264/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.