Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.55 |
| ▸ | FAAH | O00519 | 4/20 | 0.55 |
| ▸ | TLR9 | Q9NR96 | 4/20 | 0.52 |
| ▸ | G6PD | P11413 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.38 |
| ▸ | ATM | Q13315 | 2/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.38 |
| ▸ | MITF | O75030 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.37 |
| ▸ | CCR6 | P51684 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30279692 | 1.00 | MGLL (0.55) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL2596734 | 0.91 | MGLL (0.72) | MGLLFAAHTLR9G6PDHSP90AA1 | |
| SCHEMBL13385343 | 0.84 | TLR9 (0.48) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL486535 | 0.82 | MGLL (0.53) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL30272075 | 0.82 | MGLL (0.53) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL29551719 | 0.82 | MGLL (0.53) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL2596747 | 0.82 | MGLL (0.53) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL31264193 | 0.82 | MGLL (0.53) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL30104189 | 0.81 | MGLL (0.59) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL29929064 | 0.81 | MGLL (0.59) | MGLLFAAHTLR9G6PDALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024201211-A1 | ADHESIVE-ATTACHED METAL SUBSTRATE, AND LAMINATE | 藤森工業株式会社 | 2024-10-03 | — | — | WO | disclosed |
| US-20230331915-A1 | Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Product of Same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023187625-A1 | ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE | 藤森工業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023187624-A1 | ADHESIVE-EQUIPPED METAL SUBSTRATE AND LAMINATE | 藤森工業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-11608316-B2 | Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2023-03-21 | — | — | US | disclosed |
| CN-115777003-A | Isocyanate-modified polyimide resin, resin composition, and cured product thereof | 日本化药株式会社 | 2023-03-10 | — | — | CN | disclosed |
| US-11414382-B2 | Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220112373-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-109689742-B | Curable resin mixture and method for producing curable resin composition | 昭和电工株式会社 | 2021-12-10 | — | — | CN | disclosed |
| US-20210284783-A1 | METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2021-09-16 | — | — | US | disclosed |
| US-20200031973-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2020-01-30 | — | — | US | disclosed |
| CN-110546177-A | Maleimide resin composition, prepreg and cured product thereof | NIPPON KAYAKU KK | 2019-12-06 | — | — | CN | disclosed |
| EP-3239199-B1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2019-09-25 | — | — | EP | disclosed |
| EP-3511363-A1 | CURABLE RESIN MIXTURE AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION | Showa Denko K.K. (JP) | 2019-07-17 | — | — | EP | disclosed |
| US-10160856-B2 | Thermosetting resin composition | SHOWA DENKO K.K. (JP) | 2018-12-25 | — | — | US | disclosed |
| US-20180282494-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20170349743-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2017-12-07 | — | — | US | disclosed |
| EP-3239199-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3239200-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-20110042124-A1 | MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION | MITSUBISHI PLASTICS, INC. (JP) | 2011-02-24 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11414382-B2 | Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator | RAD51, RER1, REV1 | MGLL 4679/4885FAAH 2717/4885TLR9 309/4885 |
| US-11608316-B2 | Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator | RAD51, RER1, TAS1R1 | MGLL 4614/4885FAAH 3717/4885TLR9 230/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.