Fluoride

Fluoride

SCHEMBL1262299

CCO[Si](OCC)(OCC)OCC.F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL452809 0.96
SCHEMBL17680 0.96
SCHEMBL3103665 0.92
SCHEMBL9837404 0.92
SCHEMBL3134796 0.92
SCHEMBL9838784 0.92
Hydrochloric Acid SCHEMBL4886746 0.92
SCHEMBL8967299 0.92
SCHEMBL21752046 0.92
Phosphine SCHEMBL8967295 0.92 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7883946-B1 Angled implantation for deep submicron device optimization ALTERA CORPORATION (US) 2011-02-08 US claimed
CN-1316566-C Interconnects with improved barrier layer adhesion ADVANCED MICRO DEVICES INC (US) 2007-05-16 CN claimed
CN-1599949-A Interconnect structure with improved barrier adhesion ADVANCED MICRO DEVICES INC (US) 2005-03-23 CN claimed
CN-115939181-A Semiconductor device with a plurality of transistors 三星电子株式会社 2023-04-07 CN disclosed
CN-115910926-A Semiconductor device with a plurality of transistors 三星电子株式会社 2023-04-04 CN disclosed
CN-115020340-A Semiconductor device and method for manufacturing semiconductor device 三星电子株式会社 2022-09-06 CN disclosed
CN-114764164-A Optical assembly in back end of line stack of photonic chips 格芯(美国)集成电路科技有限公司 2022-07-19 CN disclosed
CN-114446898-A Semiconductor device with a plurality of semiconductor chips 中国科学院微电子研究所 2022-05-06 CN disclosed
CN-114446811-A Semiconductor device with a plurality of semiconductor chips 中国科学院微电子研究所 2022-05-06 CN disclosed
CN-113710407-A Laser machining apparatus, method of operating the same, and method of machining workpiece using the same 伊雷克托科学工业股份有限公司 2021-11-26 CN disclosed
CN-112703084-A Frame and external enclosure for laser processing system 伊雷克托科学工业股份有限公司 2021-04-23 CN disclosed
CN-111465679-A Cleaning compositions for removing post-etch or post-ash residues from semiconductor substrates and corresponding methods 巴斯夫欧洲公司 2020-07-28 CN disclosed
CN-110552199-A Radiation refrigeration composite photon structure film and preparation method thereof UNIV SHANGHAI JIAOTONG 2019-12-10 CN disclosed
CN-110061018-A Full single-chip integration of the optical lens on optical sensor substrate 弗托斯传感与算法公司 2019-07-26 CN disclosed
CN-105900238-B Monolithic integration of plenoptic lenses on photosensor substrates 弗托斯传感与算法公司 2019-06-11 CN disclosed
CN-105900238-A Monolithic integration of plenoptic lenses on photosensor substrates 伊莎贝尔·莉娜·布拉斯科怀持 2016-08-24 CN disclosed
US-8519403-B1 Angled implantation for deep submicron device optimization ALTERA CORPORATION (US) 2013-08-27 US disclosed
US-7883946-B1 Angled implantation for deep submicron device optimization ALTERA CORPORATION (US) 2011-02-08 US disclosed
CN-1316566-C Interconnects with improved barrier layer adhesion ADVANCED MICRO DEVICES INC (US) 2007-05-16 CN disclosed
CN-1599949-A Interconnect structure with improved barrier adhesion ADVANCED MICRO DEVICES INC (US) 2005-03-23 CN disclosed