SCHEMBL126640

SCHEMBL126640

CC(C)(c1ccc(C(C)(C)c2cccc(N)c2)cc1)c1cccc(N)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.57
ESR2 Q92731 3/20 0.57
TSHR P16473 2/20 0.56
MAPK1 P28482 1/20 0.56
CYP3A4 P08684 5/20 0.48
CASP1 P29466 2/20 0.48
RECQL P46063 1/20 0.48
ALDH1A1 P00352 5/20 0.45
CNR1 P21554 2/20 0.41
CNR2 P34972 2/20 0.41
AR P10275 1/20 0.41
HPGD P15428 1/20 0.41
SLC6A2 P23975 1/20 0.41
SLC6A4 P31645 1/20 0.41
HTR6 P50406 1/20 0.41
ESRRG P62508 1/20 0.41
SLC6A3 Q01959 1/20 0.41
HSD17B10 Q99714 1/20 0.41
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1725375 1.00 ESR1 (0.57) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL29408725 1.00 ESR1 (0.57) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL127692 0.96 ESR1 (0.53) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL136764 0.96 ESR1 (0.53) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL13385785 0.96 ESR1 (0.53) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL125232 0.95 TSHR (0.60) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL31476400 0.95 TSHR (0.60) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL29374282 0.95 TSHR (0.60) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL22023062 0.94 ESR1 (0.57) ESR1ESR2TSHRMAPK1CYP3A4
SCHEMBL4738363 0.94 ESR1 (0.57) ESR1ESR2TSHRMAPK1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 495 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118255988-A Polyimide molded article and method for producing same 聚酰亚胺先端材料有限公司 2024-06-28 CN claimed
CN-112996664-B Polyimide composite film with excellent dielectric properties and preparation method thereof 聚酰亚胺先端材料有限公司 2023-08-08 CN claimed
CN-112955497-B Ultrathin polyimide film with improved dimensional stability and preparation method thereof 聚酰亚胺先端材料有限公司 2023-07-11 CN claimed
CN-116406395-A Polyimide film having high dimensional stability and method for producing same 聚酰亚胺先端材料有限公司 2023-07-07 CN claimed
CN-116333674-A PI adhesive, PI film and warping-resistant FCCL product prepared from PI adhesive and PI film 广州方邦电子股份有限公司 2023-06-27 CN claimed
CN-112996664-A Polyimide composite film having excellent dielectric characteristics and method for preparing same 聚酰亚胺先端材料有限公司 2021-06-18 CN claimed
CN-112955497-A Ultrathin polyimide film with improved dimensional stability and preparation method thereof 聚酰亚胺先端材料有限公司 2021-06-11 CN claimed
US-5667899-A SELF-SUPPORTING BONDING FILM OF POLYIMIDES HITACHI CHEMICAL CO. LTD. (JP) 1997-09-16 US claimed
US-5605763-A POLYIMIDE; SEMICONDUCTORS HITACHI CHEMICAL COMPANY LTD. (JP) 1997-02-25 US claimed
US-12030999-B2 Method for producing fiber-reinforced composite material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-07-09 US disclosed
CN-118255988-A Polyimide molded article and method for producing same 聚酰亚胺先端材料有限公司 2024-06-28 CN disclosed
US-20240209207-A1 THERMOPLASTIC POLYIMIDE RESIN COMPOSITION AND MOLDED PRODUCT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-06-27 US disclosed
CN-118234784-A Polyimide film for graphite sheet and graphite sheet produced therefrom 聚酰亚胺先端材料有限公司 2024-06-21 CN disclosed
US-20240199878-A1 RESIN COMPOSITION, FORMED ARTICLE AND FILM KANEKA CORPORATION (JP) 2024-06-20 US disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
EP-0572196-A1 Polyimide, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-12-01 EP disclosed
EP-0565352-A2 Aromatic diamine and polyimde, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-13 EP disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed
US-5243019-A Heat resistant polymers HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-09-07 US disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed