Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 4/20 | 0.53 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.53 |
| ▸ | TSHR | P16473 | 3/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.52 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.44 |
| ▸ | CASP1 | P29466 | 1/20 | 0.44 |
| ▸ | RECQL | P46063 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.42 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.39 |
| ▸ | HPGD | P15428 | 2/20 | 0.39 |
| ▸ | NPC1 | O15118 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | RAB9A | P51151 | 2/20 | 0.39 |
| ▸ | CNR1 | P21554 | 2/20 | 0.39 |
| ▸ | CNR2 | P34972 | 2/20 | 0.39 |
| ▸ | AR | P10275 | 1/20 | 0.38 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.38 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.38 |
| ▸ | HTR6 | P50406 | 1/20 | 0.38 |
| ▸ | ESRRG | P62508 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13385785 | 1.00 | ESR1 (0.53) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL136764 | 1.00 | ESR1 (0.53) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL4738363 | 0.98 | ESR1 (0.57) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL22023062 | 0.98 | ESR1 (0.57) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL126640 | 0.96 | ESR1 (0.57) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL29408725 | 0.96 | ESR1 (0.57) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL1725375 | 0.96 | ESR1 (0.57) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL8977863 | 0.91 | ESR1 (0.63) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL137216 | 0.91 | ESR1 (0.63) | ESR1ESR2TSHRMAPK1CYP3A4 | |
| SCHEMBL125232 | 0.91 | TSHR (0.60) | ESR1ESR2TSHRMAPK1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | claimed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | claimed |
| WO-2024009969-A1 | ADHESIVE COMPOSITION, BONDING FILM, LAMINATE WITH ADHESIVE COMPOSITION LAYER, LAMINATE, AND ELECTROMAGNETIC WAVE SHIELD FILM | 東亞合成株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| WO-2020137879-A1 | POWDER LIQUID DISPERSION, LAYERED PRODUCT, AND PRINTED BASE BOARD | ＡＧＣ株式会社 | 2020-07-02 | — | — | WO | disclosed |
| US-10580640-B2 | Kit and laminate | FUJIFILM CORPORATION (JP) | 2020-03-03 | — | — | US | disclosed |
| US-10575402-B2 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-02-25 | — | — | US | disclosed |
| US-20190281697-A1 | RESIN COMPOSITION, WIRING LAYER LAMINATE FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2019-09-12 | — | — | US | disclosed |
| US-10287458-B2 | Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film | FUJIFILM CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-20180016471-A1 | LAMINATE, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM | FUJIFILM CORPORATION (JP) | 2018-01-18 | — | — | US | disclosed |
| US-20180012751-A1 | KIT AND LAMINATE | FUJIFILM CORPORATION (JP) | 2018-01-11 | — | — | US | disclosed |
| US-20010035533-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-11-01 | — | — | US | disclosed |
| US-20010016384-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-08-23 | — | — | US | disclosed |
| US-20010009780-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-07-26 | — | — | US | disclosed |
| EP-1032036-A2 | Semiconductor device and process for fabrication thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| EP-0984051-A1 | HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-03-08 | — | — | EP | disclosed |
| EP-0837498-A1 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE | HITACHI CHEMICAL CO., LTD. (JP) | 1998-04-22 | — | — | EP | disclosed |
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | disclosed |
| US-5243019-A | Heat resistant polymers | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1993-09-07 | — | — | US | disclosed |