Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 9/20 | 0.33 |
| ▸ | CA12 | O43570 | 2/20 | 0.33 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | CA3 | P07451 | 2/20 | 0.33 |
| ▸ | CA4 | P22748 | 2/20 | 0.33 |
| ▸ | CA6 | P23280 | 2/20 | 0.33 |
| ▸ | CA5A | P35218 | 2/20 | 0.33 |
| ▸ | CA7 | P43166 | 2/20 | 0.33 |
| ▸ | CA9 | Q16790 | 2/20 | 0.33 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.33 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL307804 | 0.98 | NFKB1 (0.30) | — | |
| SCHEMBL126038 | 0.94 | — | — | |
| SCHEMBL9229787 | 0.91 | — | — | |
| SCHEMBL2921445 | 0.87 | — | — | |
| SCHEMBL7809693 | 0.84 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7799177 | 0.84 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7799125 | 0.84 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7808183 | 0.84 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7545455 | 0.84 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL9698886 | 0.82 | DNM1 (0.40) | DNM1CA12CA1CA2CA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | disclosed |
| US-20220289976-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | TORAY INDUSTRIES, INC. (JP) | 2022-09-15 | — | — | US | disclosed |
| WO-2022059167-A1 | METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059716-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-20 | — | — | US | disclosed |
| US-20210405529-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-30 | — | — | US | disclosed |
| US-20070098995-A1 | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-1721740-A1 | HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2006-11-15 | — | — | EP | disclosed |
| EP-1407879-A1 | HEAT-RESISTANT RESIN FILM WITH METAL LAYER AND WIRING BOARD AND METHOD FOR MANUFACTURING THEM | TORAY INDUSTRIES, INC. (JP) | 2004-04-14 | — | — | EP | disclosed |
| US-20030170431-A1 | Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them | TORAY INDUSTRIES, INC. (JP) | 2003-09-11 | — | — | US | disclosed |
| EP-0510638-B1 | Silicon-modified polyimide film and process for producing same | CHISSO CORP (JP) | 1995-10-11 | — | — | EP | disclosed |
| US-5300364-A | Metal-clad laminates and method for producing same | CHISSO CORPORATION (JP) | 1994-04-05 | — | — | US | disclosed |
| EP-0510638-A1 | Silicon-modified polyimide film and process for producing same | CHISSO CORPORATION (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0498898-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING | CHISSO CORPORATION (JP) | 1992-08-19 | — | — | EP | disclosed |
| EP-0496334-A1 | A flexible base laminated with metal on both the surfaces and a process for producing same | CHISSO CORPORATION (JP) | 1992-07-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | LIPA, MLLT3, EPB41L2 | DNM1 920/4885CA12 387/4885CA1 141/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.