SCHEMBL307804

SCHEMBL307804

CO[Si](OC)(O[Si](C)(C)CCCCN)O[Si](C)(C)CCCCN

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
NFKB1 P19838 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL127783 0.98 DNM1 (0.33)
SCHEMBL126038 0.96
SCHEMBL9229787 0.93
SCHEMBL2921445 0.89
SCHEMBL309272 0.84
SCHEMBL202975 0.84 NFKB1 (0.39) NFKB1
SCHEMBL19286514 0.83 NFKB1 (0.30) NFKB1
SCHEMBL7808183 0.81 DNM1 (0.42) NFKB1
SCHEMBL7809693 0.81 DNM1 (0.42) NFKB1
SCHEMBL568547 0.81 NFKB1 (0.37) NFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2949719-B1 ADHESIVE COMPOSITION TORAY INDUSTRIES (JP) 2022-11-09 EP claimed
US-20240381529-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG RESONAC CORPORATION (JP) 2024-11-14 US disclosed
US-20230331946-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-10-19 US disclosed
EP-2949719-B1 ADHESIVE COMPOSITION TORAY INDUSTRIES (JP) 2022-11-09 EP disclosed
US-20220289976-A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE TORAY INDUSTRIES, INC. (JP) 2022-09-15 US disclosed
US-20220019146-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-01-20 US disclosed
US-20210405529-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-12-30 US disclosed
US-20210278767-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-09 US disclosed
EP-3842863-A1 FILM FORMATION MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-30 EP disclosed
US-20210165327-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-03 US disclosed
US-20070225438-A1 Resin Paste for Die Bonding HITACHI CHEMICAL CO., LTD. (JP) 2007-09-27 US disclosed
US-20070169886-A1 Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device TORAY INDUSTRIES, INC. (JP) 2007-07-26 US disclosed
US-20070098995-A1 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device HITACHI CHEMICAL CO., LTD. (JP) 2007-05-03 US disclosed
EP-1721740-A1 HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2006-11-15 EP disclosed
EP-1407879-A1 HEAT-RESISTANT RESIN FILM WITH METAL LAYER AND WIRING BOARD AND METHOD FOR MANUFACTURING THEM TORAY INDUSTRIES, INC. (JP) 2004-04-14 EP disclosed
US-20030170431-A1 Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them TORAY INDUSTRIES, INC. (JP) 2003-09-11 US disclosed
EP-0510638-B1 Silicon-modified polyimide film and process for producing same CHISSO CORP (JP) 1995-10-11 EP disclosed
US-5300364-A Metal-clad laminates and method for producing same CHISSO CORPORATION (JP) 1994-04-05 US disclosed
EP-0510638-A1 Silicon-modified polyimide film and process for producing same CHISSO CORPORATION (JP) 1992-10-28 EP disclosed
EP-0496334-A1 A flexible base laminated with metal on both the surfaces and a process for producing same CHISSO CORPORATION (JP) 1992-07-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20210165327-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN RALA, MRPL19, MRPL9 NFKB1 4478/4885
US-20220019146-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN LIPA, MLLT3, EPB41L2 NFKB1 4323/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.