SCHEMBL13040955

SCHEMBL13040955

CN1C(=O)CC(Nc2ccccc2)C1=O

nearest known ligand 0.68

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 10/20 0.68
MAPT P10636 7/20 0.68
GAA P10253 4/20 0.68
SMN1; SMN2 Q16637 2/20 0.68
KDM4E B2RXH2 2/20 0.68
HTT P42858 2/20 0.60
KMT2A Q03164 3/20 0.53
TSHR P16473 1/20 0.53
MEN1 O00255 2/20 0.52
THRB P10828 1/20 0.52
RECQL P46063 1/20 0.52
POLB P06746 1/20 0.52
NPSR1 Q6W5P4 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
ALOX12 P18054 1/20 0.47
CYP1A2 P05177 1/20 0.47
CYP3A4 P08684 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7498372 0.78 HTT (0.81) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL9327915 0.77 SMN1; SMN2 (0.76) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL14880582 0.72 TSHR (0.56) SMN1; SMN2KMT2ATSHRNPSR1
SCHEMBL5237110 0.71 ALDH1A1 (0.49) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL14463511 0.71 ALDH1A1 (0.49) ALDH1A1MAPTGAASMN1; SMN2KDM4E
Hydrochloric Acid SCHEMBL5240143 0.70 ALDH1A1 (0.47) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL16378120 0.70 ALDH1A1 (0.47) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL12994836 0.70 ALDH1A1 (0.47) ALDH1A1MAPTGAASMN1; SMN2KDM4E
SCHEMBL26936411 0.69 ALDH1A1 (1.00) ALDH1A1MAPTGAASMN1; SMN2KDM4E
Phensuximide SCHEMBL35333 0.69 KMT2A (1.00) ALDH1A1MAPTSMN1; SMN2KMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10604641-B2 Thermosetting resin composition and prepreg and laminate both made with the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-03-31 US disclosed
US-10414943-B2 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-09-17 US disclosed
US-20180094162-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE HITACHI CHEMICAL CO LTD (JP) 2018-04-05 US disclosed
US-20180094162-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE HITACHI CHEMICAL CO LTD (JP) 2018-04-05 US disclosed
EP-2518115-B1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE HITACHI CHEMICAL CO LTD (JP) 2017-10-18 EP disclosed
US-20170156207-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME HITACHI CHEMICAL CO LTD (JP) 2017-06-01 US disclosed
US-9603244-B2 Thermosetting resin composition and prepreg and laminate obtained with the same HITACHI CHEMICAL COMPANY, LTD (JP) 2017-03-21 US disclosed
US-9603244-B2 Thermosetting resin composition and prepreg and laminate obtained with the same HITACHI CHEMICAL COMPANY, LTD (JP) 2017-03-21 US disclosed
US-20170022353-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME RESONAC CORPORATION (JP) 2017-01-26 US disclosed
US-20170022353-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME RESONAC CORPORATION (JP) 2017-01-26 US disclosed
US-20160234942-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE RESONAC CORPORATION (JP) 2016-08-11 US disclosed
US-20160230037-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE HITACHI CHEMICAL CO LTD (JP) 2016-08-11 US disclosed
US-8796473-B2 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-08-05 US disclosed
US-8461332-B2 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-11 US disclosed
US-20120316263-A1 Method for Producing Curing Agent Having Acidic Substituent and Unsaturated Maleimide Group, Thermosetting Resin Composition, Prepreg, and Laminate RESONAC CORPORATION (JP) 2012-12-13 US disclosed
US-20120276392-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-01 US disclosed
US-20100279129-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME. HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-11-04 US disclosed
US-20100173163-A1 METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE RESONAC CORPORATION (JP) 2010-07-08 US disclosed
US-20100143728-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME RESONAC CORPORATION (JP) 2010-06-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100173163-A1 METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE ITGAM, ITGB6, PRPF6 ALDH1A1 400/4885MAPT 146/4885GAA 2756/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.