Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 2/20 | 0.38 |
| ▸ | GPR84 | Q9NQS5 | 5/20 | 0.36 |
| ▸ | TLR2 | O60603 | 4/20 | 0.36 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.34 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.34 |
| ▸ | ZDHHC7 | Q9NXF8 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | LCK | P06239 | 1/20 | 0.33 |
| ▸ | PPARD | Q03181 | 1/20 | 0.33 |
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.33 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10353554 | 0.97 | CA2 (0.39) | CA2CA1GPR84TLR2FFAR1 | |
| SCHEMBL194208 | 0.97 | CA2 (0.39) | CA2CA1GPR84TLR2FFAR1 | |
| SCHEMBL106263 | 0.88 | CA2 (0.39) | CA2CA1GPR84FFAR1NFKB1 | |
| SCHEMBL678322 | 0.85 | GPR84 (0.40) | GPR84FFAR1ZDHHC7MAPTLCK | |
| SCHEMBL4559352 | 0.84 | GPR84 (0.39) | GPR84FFAR1ZDHHC7MAPTLCK | |
| SCHEMBL27968380 | 0.79 | USP2 (0.41) | GPR84TLR2FFAR1ZDHHC7 | |
| SCHEMBL18831983 | 0.76 | GPR84 (0.40) | GPR84FFAR1ZDHHC7MAPTLCK | |
| SCHEMBL28432994 | 0.75 | GPR84 (0.39) | GPR84FFAR1ZDHHC7MAPTLCK | |
| SCHEMBL7161840 | 0.74 | FDPS (0.36) | GPR84TLR2FFAR1ZDHHC7 | |
| SCHEMBL27968388 | 0.73 | TSHR (0.43) | TLR2ZDHHC7MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9464191-B2 | Silicon-containing curing composition and cured product thereof | ADEKA CORPORATION (JP) | 2016-10-11 | — | — | US | claimed |
| CN-117730123-A | Heat conductive silicone composition | 美国陶氏有机硅公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-117223095-A | Method for peeling polymer film, method for manufacturing electronic device, and peeling apparatus | 东洋纺株式会社 | 2023-12-12 | — | — | CN | disclosed |
| US-20230303789-A1 | LAMINATE AND MEDICAL DEVICE | FUJIFILM CORPORATION (JP) | 2023-09-28 | — | — | US | disclosed |
| CN-116710274-A | Method for producing laminate, and multilayer laminate | 东洋纺株式会社 | 2023-09-05 | — | — | CN | disclosed |
| US-20230135925-A1 | FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPIC MEDICAL DEVICE, AND METHODS FOR PRODUCING THE SAME | FUJIFILM CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| CN-115697871-A | Method for peeling polymer film, method for manufacturing electronic device, and peeling apparatus | 东洋纺株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-109791352-B | Photosensitive resin composition, method for producing conductive pattern, substrate, touch panel, and display | 东丽株式会社 | 2022-07-29 | — | — | CN | disclosed |
| EP-3932971-A1 | ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, AND ENDOSCOPE AND MANUFACTURING METHOD THEREOF | FUJIFILM Corporation (JP) | 2022-01-05 | — | — | EP | disclosed |
| WO-2021260972-A1 | POLYMER FILM PEELING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND PEELING DEVICE | 東洋紡株式会社 | 2021-12-30 | — | — | WO | disclosed |
| US-20130260207-A1 | BATTERY ELECTRODE OR SEPARATOR SURFACE PROTECTIVE AGENT COMPOSITION, BATTERY ELECTRODE OR SEPARATOR PROTECTED BY THE COMPOSITION, AND BATTERY HAVING THE BATTERY ELECTRODE OR SEPARATOR | KYORITSU CHEMICAL & CO., LTD. (JP) | 2013-10-03 | — | — | US | disclosed |
| EP-2508569-B1 | Silicone resin composition and optical semiconductor device using the composition | SHINETSU CHEMICAL CO (JP) | 2013-09-04 | — | — | EP | disclosed |
| US-8518626-B2 | Carrier, method for preparing the carrier, developer using the carrier, developer container, and image forming method and apparatus and process cartridge using the developer | RICOH COMPANY, LIMITED (JP) | 2013-08-27 | — | — | US | disclosed |
| US-8481656-B2 | Silicone resin composition and optical semiconductor device using the composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-07-09 | — | — | US | disclosed |
| US-20120256325-A1 | SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-11 | — | — | US | disclosed |
| EP-2508569-A1 | Silicone resin composition and optical semiconductor device using the composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-10-10 | — | — | EP | disclosed |
| US-20120056236-A1 | LOW GAS PERMEABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-08 | — | — | US | disclosed |
| US-20110269918-A1 | HIGH ADHESIVENESS SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE PROVIDED WITH A CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-03 | — | — | US | disclosed |
| US-20110229817-A1 | CARRIER, METHOD FOR PREPARING THE CARRIER, DEVELOPER USING THE CARRIER, DEVELOPER CONTAINER, AND IMAGE FORMING METHOD AND APPARATUS AND PROCESS CARTRIDGE USING THE DEVELOPER | RICOH COMPANY LIMITED (JP) | 2011-09-22 | — | — | US | disclosed |
| US-20100059448-A1 | MAGNETIC PARTICLES FOR WATER PURIFICATION AND WATER TREATMENT METHOD EMPLOYING THE SAME | KABUSHIKI KAISHA TOSHIBA (JP) | 2010-03-11 | — | — | US | disclosed |