SCHEMBL132269

SCHEMBL132269

CCC(C)(C)C(=O)OC1CCC(C)CC1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 2/20 0.40
CHRM3 P20309 3/20 0.35
HMGCR P04035 2/20 0.34
MLNR O43193 1/20 0.34
CHRM2 P08172 1/20 0.34
CHRM1 P11229 1/20 0.34
HTR2A P28223 1/20 0.34
HTR2C P28335 1/20 0.34
HRH1 P35367 1/20 0.34
OPRM1 P35372 1/20 0.34
DRD3 P35462 1/20 0.34
OPRK1 P41145 1/20 0.34
HTR2B P41595 1/20 0.34
SLC6A3 Q01959 1/20 0.34
KCNH2 Q12809 1/20 0.34
CACNA1C Q13936 1/20 0.34
FKBP1A P62942 2/20 0.33
EPHX1 P07099 1/20 0.33
APOBEC3A P31941 1/20 0.33
APOBEC3G Q9HC16 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3434648 0.92 EPHX1 (0.37) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL131566 0.89 CYP19A1 (0.42) CYP19A1HMGCRCHRM1HTR2AOPRM1
SCHEMBL2625661 0.85 CHRM3 (0.34) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL2754858 0.85 CHRM3 (0.34) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL18119952 0.85 FKBP1A (0.34) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL2625659 0.85 APOBEC3A (0.36) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL3435204 0.85 EPHX1 (0.43) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL132134 0.85 EPHX1 (0.47) CYP19A1CHRM3HMGCRMLNRCHRM2
SCHEMBL9925224 0.85 TPSAB1 (0.39) CHRM3
SCHEMBL12736995 0.84 CYP19A1 (0.43) CYP19A1CHRM3HMGCRMLNRCHRM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11073763-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-07-27 US disclosed
US-20200133125-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2020-04-30 US disclosed
US-20190346766-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-11-14 US disclosed
US-10365561-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2019-07-30 US disclosed
US-20190041749-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-02-07 US disclosed
US-9958775-B2 Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blanks including actinic ray-sensitive or radiation-sensitive film, pattern forming method and photomask FUJIFILM CORPORATION (JP) 2018-05-01 US disclosed
US-9952509-B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2018-04-24 US disclosed
US-20180087010-A1 PRE-RINSING LIQUID, PRE-RINSING TREATMENT METHOD, AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2018-03-29 US disclosed
US-9760003-B2 Pattern forming method and actinic-ray- or radiation-sensitive resin composition FUJIFILM CORPORATION (JP) 2017-09-12 US disclosed
US-20170242338-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-08-24 US disclosed
US-20080193878-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-08-14 US disclosed
US-20080096134-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-24 US disclosed
US-20080081289-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080081292-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080081290-A1 RESIST COMPOSITION, RESIN FOR USE IN THE RESIST COMPOSITION, COMPOUND FOR USE IN THE SYNTHESIS OF THE RESIN, AND PATTERN-FORMING METHOD USING THE RESIST COMPOSITION FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080076062-A1 RESIST COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080050675-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-02-28 US disclosed
US-20070224539-A1 Resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2007-09-27 US disclosed
US-20070218406-A1 Acid generator; exposure to actinic radiation FUJIFILM CORPORATION (JP) 2007-09-20 US disclosed
US-20070172761-A1 Positive photosensitive composition and method of forming pattern using the same FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed