⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30159634 | 0.85 | CA1 (0.38) | — | |
| SCHEMBL159732 | 0.85 | CA1 (0.38) | — | |
| Ethylene SCHEMBL27752633 | 0.80 | CA12 (0.35) | — | |
| SCHEMBL1324603 | 0.78 | AR (0.38) | — | |
| SCHEMBL28743214 | 0.74 | CA12 (0.31) | — | |
| SCHEMBL28795709 | 0.74 | CA12 (0.31) | — | |
| SCHEMBL2405150 | 0.74 | CA1 (0.62) | — | |
| SCHEMBL1305477 | 0.73 | PIM1 (0.34) | — | |
| SCHEMBL3994528 | 0.73 | ALDH1A1 (0.52) | — | |
| SCHEMBL9804828 | 0.73 | GAA (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20050288458-A1 | Reworkable thermosetting resin composition | KLEMARCZYK PHILIP T | 2005-12-29 | — | — | US | claimed |
| EP-1268457-A4 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORP (US) | 2005-07-20 | — | — | EP | claimed |
| US-6887737-B1 | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom | HENKEL CORPORATION (US) | 2005-05-03 | — | — | US | claimed |
| US-6657031-B1 | Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors | LOCTITE CORPORATION | 2003-12-02 | — | — | US | claimed |
| JP-2003529643-A | — | — | 2003-10-07 | — | — | JP | claimed |
| WO-2003051955-A1 | EPOXIDIZED ACETALS AND THIOACETALS, EPISULFIDIZED ACETALS AND THIOACETALS, AND REWORKABLE THERMOSETTING RESIN COMPOSITIONS FORMULATED THEREFROM | HENKEL CORPORATION (US) | 2003-06-26 | — | — | WO | claimed |
| US-6572980-B1 | Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics | HENKEL LOCTITE CORPORATION | 2003-06-03 | — | — | US | claimed |
| US-20030073770-A1 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | Henkel IP & Holding GmbH (DE) | 2003-04-17 | — | — | US | claimed |
| EP-1268457-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2003-01-02 | — | — | EP | claimed |
| JP-2002540235-A | — | — | 2002-11-26 | — | — | JP | claimed |
| WO-2001074798-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2001-10-11 | — | — | WO | claimed |
| EP-1090057-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2001-04-11 | — | — | EP | claimed |
| WO-2000056799-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2000-09-28 | — | — | WO | claimed |
| EP-3357959-B1 | LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF | ARLON LLC (US) | 2020-11-25 | — | — | EP | disclosed |
| US-10418148-B2 | Low loss pre-pregs and laminates and compositions useful for the preparation thereof | ARLON LLC (US) | 2019-09-17 | — | — | US | disclosed |
| US-10123412-B2 | Thermosetting polymer formulations, circuit materials, and methods of use thereof | ROGERS CORPORATION (US) | 2018-11-06 | — | — | US | disclosed |
| EP-1090057-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2001-04-11 | — | — | EP | disclosed |
| WO-2000079582-A9 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORP (US) | 2001-03-15 | — | — | WO | disclosed |
| WO-2000079582-A1 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2000-12-28 | — | — | WO | disclosed |
| WO-2000056799-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2000-09-28 | — | — | WO | disclosed |