SCHEMBL1325698

SCHEMBL1325698

N#COc1cc2ccccc2c(OC#N)c1OC#N

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 3/20 0.36
CA1 P00915 3/20 0.36
CA2 P00918 3/20 0.36
ALDH1A1 P00352 1/20 0.34
HIF1A Q16665 1/20 0.34
CYP1B1 Q16678 1/20 0.34
HSD17B10 Q99714 1/20 0.34
CLK1 P49759 1/20 0.32
DYRK1A Q13627 1/20 0.32
ERN1 O75460 1/20 0.32
CYP2A6 P11509 2/20 0.32
TRPM4 Q8TD43 1/20 0.31
HTR2A P28223 1/20 0.31
NQO1 P15559 1/20 0.31
NQO2 P16083 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
CYP1A2 P05177 1/20 0.31
TUBB4A P04350 1/20 0.30
TUBB P07437 1/20 0.30
TUBA3C P0DPH7 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20281311 0.84 GPR84 (0.44) GPR84CA1CA2ALDH1A1HIF1A
SCHEMBL1325259 0.79 MAPT (0.41) CA1CA2ALDH1A1HIF1ACYP1B1
SCHEMBL30739576 0.79 GPR84 (0.36) GPR84ALDH1A1HIF1AHSD17B10L3MBTL1
SCHEMBL28065752 0.78 CYP2A6 (0.39) GPR84CA1CA2ALDH1A1HSD17B10
SCHEMBL7109900 0.75 CA1 (0.38) GPR84CA1CA2ALDH1A1HIF1A
SCHEMBL7106894 0.75 ALDH1A1 (0.36) GPR84CA1CA2ALDH1A1HIF1A
SCHEMBL29364866 0.74 CA1 (0.36) GPR84CA1CA2ALDH1A1HIF1A
SCHEMBL27844346 0.74 HSD17B10 (0.39) CA1CA2ALDH1A1HIF1ACYP1B1
SCHEMBL184763 0.74 CA1 (0.36) GPR84CA1CA2ALDH1A1HIF1A
SCHEMBL7108620 0.73 CA1 (0.36) GPR84CA1CA2ALDH1A1ERN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050288458-A1 Reworkable thermosetting resin composition KLEMARCZYK PHILIP T 2005-12-29 US claimed
EP-1268457-A4 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORP (US) 2005-07-20 EP claimed
US-6887737-B1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom HENKEL CORPORATION (US) 2005-05-03 US claimed
US-6657031-B1 Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors LOCTITE CORPORATION 2003-12-02 US claimed
JP-2003529643-A 2003-10-07 JP claimed
WO-2003051955-A1 EPOXIDIZED ACETALS AND THIOACETALS, EPISULFIDIZED ACETALS AND THIOACETALS, AND REWORKABLE THERMOSETTING RESIN COMPOSITIONS FORMULATED THEREFROM HENKEL CORPORATION (US) 2003-06-26 WO claimed
US-6572980-B1 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics HENKEL LOCTITE CORPORATION 2003-06-03 US claimed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US claimed
EP-1268457-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2003-01-02 EP claimed
JP-2002540235-A 2002-11-26 JP claimed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO claimed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP claimed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO claimed
US-4876153-A WITH SILICONE COATED RELEASE FILM, CATALYST-FREE OR CONTAINING LOW RESIDUAL LEVELS BASF CORPORATION (US) 1989-10-24 US claimed
EP-0295375-A2 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack BASF Aktiengesellschaft (DE) 1988-12-21 EP claimed
EP-3837715-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-23 EP disclosed
WO-2020037199-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2020-02-20 WO disclosed
EP-0295375-A2 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack BASF Aktiengesellschaft (DE) 1988-12-21 EP disclosed
US-4370462-A MODIFIED POLYIMIDES HAVING ACETYLENIC END GROUPS AND AN AROMATIC POLYISOCYANATO COMPOUND OR VARNISHES; POLYMER; SOLUBILITY; VARNISHES; LAMINATION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US disclosed
US-4287014-A WHEREIN THE COMPOSITION CONTAINS POLYETHYLENE WITH A CROSSLINKING AGENT, AND A CYANATE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1981-09-01 US disclosed