SCHEMBL13306325

SCHEMBL13306325

O=C(Nc1ccc(Oc2cccc(Oc3ccc(NC(=O)c4ccc(N5C(=O)C=CC5=O)cc4)cc3)c2)cc1)c1ccc(N2C(=O)C=CC2=O)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PGR P06401 2/20 0.58
MGLL Q99685 1/20 0.55
NR1H4 Q96RI1 2/20 0.51
AR P10275 1/20 0.51
CRHBP P24387 1/20 0.49
CRHR2 Q13324 1/20 0.49
HPSE Q9Y251 1/20 0.49
ASF1A Q9Y294 1/20 0.48
FFAR1 O14842 1/20 0.48
HDAC1 Q13547 1/20 0.47
MTNR1A P48039 1/20 0.47
MTNR1B P49286 1/20 0.47
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
CASP3 P42574 1/20 0.46
SENP8 Q96LD8 1/20 0.46
SENP7 Q9BQF6 1/20 0.46
SENP6 Q9GZR1 1/20 0.46
F2 P00734 1/20 0.46
PLG P00747 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12268724 1.00 PGR (0.58) PGRMGLLNR1H4ARCRHBP
SCHEMBL26764181 0.84 MGLL (0.64) MGLLMEN1KMT2AF2
SCHEMBL12268727 0.84 PGR (0.48) PGRMGLLMEN1KMT2A
SCHEMBL13306326 0.84 PGR (0.48) PGRMGLLMEN1KMT2A
SCHEMBL12268629 0.84 DDAH1 (0.59) MGLLMEN1KMT2A
SCHEMBL8404261 0.84 DDAH1 (0.59) MGLLMEN1KMT2A
SCHEMBL486855 0.82 MGLL (0.79) MGLLMEN1KMT2A
SCHEMBL12268614 0.80 PTPN1 (0.56) MGLLMEN1KMT2A
SCHEMBL11937128 0.80 HSP90AA1 (0.60) MGLLHDAC1MEN1KMT2A
SCHEMBL24119952 0.79 MGLL (0.74) MGLLMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8932705-B2 Thermosetting resin composition and board using the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-01-13 US disclosed
US-8932705-B2 Thermosetting resin composition and board using the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-01-13 US disclosed
US-20100159231-A1 THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-06-24 US disclosed
US-20100159231-A1 THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-06-24 US disclosed