SCHEMBL1334041

SCHEMBL1334041

Nc1cc(C(F)(F)c2ccc(O)c(N)c2)ccc1O

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 11/20 0.63
GAA P10253 7/20 0.63
MAPT P10636 4/20 0.63
MEN1 O00255 3/20 0.63
KMT2A Q03164 3/20 0.63
PKM P14618 3/20 0.63
RECQL P46063 2/20 0.63
HSD17B10 Q99714 7/20 0.46
ALOX15 P16050 6/20 0.46
HPGD P15428 5/20 0.46
ALOX12 P18054 3/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MAPK1 P28482 1/20 0.46
CHEK1 O14757 1/20 0.46
FYN P06241 1/20 0.46
PDGFRB P09619 1/20 0.46
PIM1 P11309 1/20 0.46
FGFR1 P11362 1/20 0.46
FLT1 P17948 1/20 0.46
GRK5 P34947 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6856263 0.92 ALDH1A1 (0.55) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL1023841 0.86 ALDH1A1 (0.63) ALDH1A1GAAMAPTMEN1KMT2A
Hydrochloric Acid SCHEMBL27691184 0.84 ALDH1A1 (0.61) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL31328380 0.83 ALDH1A1 (0.59) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL13893749 0.83 ALDH1A1 (0.70) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL1025130 0.83 ALDH1A1 (0.59) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL1025773 0.83 ALDH1A1 (0.59) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL26579 0.83 ALDH1A1 (0.59) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL31473737 0.83 ALDH1A1 (0.70) ALDH1A1GAAMAPTMEN1KMT2A
SCHEMBL6757920 0.83 ALDH1A1 (0.59) ALDH1A1GAAMAPTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
CN-119439625-A Negative photosensitive resin composition, pattern forming method, cured coating film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-02-14 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-20210309866-A1 LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-07 US disclosed
EP-3812805-A1 LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-04-28 EP disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
CN-107429059-B Energy-sensitive resin composition 东京应化工业株式会社 2020-10-23 CN disclosed
CN-106575080-B Energy-sensitive resin composition 东京应化工业株式会社 2020-08-11 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 US disclosed
US-20090030173-A1 NOVEL FLUORINE-CONTAINING DICARBOXYLIC ACIDS AND THEIR NOVEL POLYMER COMPOUNDS CENTRAL GLASS COMPANY, LIMITED (JP) 2009-01-29 US disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-6780561-B2 FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD KANSAI PAINT CO., LTD. (JP) 2004-08-24 US disclosed
US-20040152862-A1 Optical resins and applications thereof HITACHI CHEMICAL CO., LTD. (JP) 2004-08-05 US disclosed
US-20030143480-A1 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board KANSAI PAINT CO., LTD. (JP) 2003-07-31 US disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
US-6384182-B2 REACTING A DICARBOXYLIC ACID WITH A BIS(AMINOPHENOL) TO FORM A POLYHYDROXYAMIDE FOLLOWED BY CYCLIZATION; USEFUL AS INSULATING AND COATING MATERIALS CENTRAL GLASS COMPANY, LIMITED (JP) 2002-05-07 US disclosed
US-20010051705-A1 Fluorine-containing polybenzoxazole CENTRAL GLASS COMPANY, LIMITED 2001-12-13 US disclosed
US-6291635-B1 LOW DIELECTRIC CONSTANT AND LOW COEFFICIENT OF THERMAL EXPANSION CENTRAL GLASS COMPANY, LIMITED (JP) 2001-09-18 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 ALDH1A1 1737/4885GAA 1879/4885MAPT 35/4885
US-20090030173-A1 NOVEL FLUORINE-CONTAINING DICARBOXYLIC ACIDS AND THEIR NOVEL POLYMER COMPOUNDS AFF1, ODC1, DDC ALDH1A1 527/4885GAA 2269/4885MAPT 1589/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.