⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL6052085 | 0.98 | — | — | |
| Imidazole SCHEMBL25324984 | 0.84 | ALDH1A1 (0.34) | — | |
| SCHEMBL446293 | 0.84 | — | — | |
| SCHEMBL7537337 | 0.81 | HDAC6 (0.33) | — | |
| SCHEMBL30962517 | 0.80 | — | — | |
| SCHEMBL28317880 | 0.70 | — | — | |
| SCHEMBL13140760 | 0.70 | TSHR (0.39) | — | |
| SCHEMBL10521524 | 0.69 | — | — | |
| Hydrochloric Acid SCHEMBL28321164 | 0.69 | LMNA (0.31) | — | |
| Ammonia Solution, Strong SCHEMBL6052142 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1294 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122081911-A | High-stability electroless copper plating solution and preparation method and application thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-122080937-A | BOE etching solution and preparation method thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-122060392-A | Water-based polyurethane coating applied to carbon fiber material and preparation method thereof | 四川颜鼎水性环保漆科技有限公司 | 2026-05-19 | — | — | CN | claimed |
| EP-4661890-A1 | PTP1B/TC-PTP DUAL INHIBITORS AND PROTEIN DEGRADERS | Purdue Research Foundation (US) | 2025-12-17 | — | — | EP | claimed |
| US-20250361432-A1 | Slurry Composition for Chemical Mechanical Polishing | KCTECH CO LTD (KR) | 2025-11-27 | — | — | US | claimed |
| US-20250297194-A1 | CLEANING METHOD OF SEMICONDUCTOR DEVICE, CLEANING APPARATUS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CLEANING COMPOSITION | DAXIN MATERIALS CORPORATION (TW) | 2025-09-25 | — | — | US | claimed |
| EP-4621829-A1 | CLEANING METHOD OF SEMICONDUCTOR DEVICE, CLEANING APPARATUS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CLEANING COMPOSITION | Daxin Materials Corporation (TW) | 2025-09-24 | — | — | EP | claimed |
| EP-3774680-B1 | CLEANING COMPOSITIONS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-09-24 | — | — | EP | claimed |
| CN-120082889-A | Alkaline microetching solution and preparation method and microetching method thereof | 深圳市板明科技股份有限公司 | 2025-06-03 | — | — | CN | claimed |
| WO-2025108836-A1 | COMPOSITIONS FOR REMOVING PHOTORESIST AND ETCH RESIDUES, METHODS OF USING AND USE THEREOF | MERCK PATENT GMBH (DE) | 2025-05-30 | — | — | WO | claimed |
| WO-1997027331-A2 | METHODS AND COMPOSITIONS FOR DETERMINING THE SEQUENCE OF NUCLEIC ACID MOLECULES | RAPIGENE, INC. (US) | 1997-07-31 | — | — | WO | claimed |
| WO-1997027327-A2 | METHODS AND COMPOSITIONS FOR DETECTING BINDING OF LIGAND PAIR USING NON-FLUORESCENT LABEL | RAPIGENE, INC. (US) | 1997-07-31 | — | — | WO | claimed |
| EP-0617146-B1 | Anodizing and duplex protection of aluminium copper alloys | BAUMAN ALBERT J (US) | 1997-05-21 | — | — | EP | claimed |
| EP-0773298-A1 | Monitoring the level of microbiological activity of a fluid system | NALCO CHEMICAL COMPANY (US) | 1997-05-14 | — | — | EP | claimed |
| US-5447661-A | Storage stable, carbon black, organic peroxide, benzotriazole compound | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-09-05 | — | — | US | claimed |
| US-5362569-A | Anodizing and duplex protection of aluminum copper alloys | SHULMAN, GARSON P. | 1994-11-08 | — | — | US | claimed |
| EP-0620248-A1 | Conductive silicone rubber compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1994-10-19 | — | — | EP | claimed |
| EP-0617146-A1 | Anodizing and duplex protection of aluminium copper alloys | Bauman, Albert J. (US) | 1994-09-28 | — | — | EP | claimed |
| US-4847178-A | Positive photosensitive o-quinone diazide composition with benzotriazole carboxylic acid or alkyl ester | TOKYO OHKA KOGYO CO., LTD. (JP) | 1989-07-11 | — | — | US | claimed |
| US-4741987-A | Photopolymerizable composition including benzotriazole carboxylic acid | PHOTOPOLY OHKA CO., LTD. (JP) | 1988-05-03 | — | — | US | claimed |