Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACACB | O00763 | 3/20 | 0.60 |
| ▸ | ACACA | Q13085 | 3/20 | 0.60 |
| ▸ | PPARG | P37231 | 1/20 | 0.47 |
| ▸ | PPARA | Q07869 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.43 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.43 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | PRMT3 | O60678 | 2/20 | 0.41 |
| ▸ | CARM1 | Q86X55 | 2/20 | 0.41 |
| ▸ | PRMT6 | Q96LA8 | 2/20 | 0.41 |
| ▸ | PRMT1 | Q99873 | 2/20 | 0.41 |
| ▸ | PRMT8 | Q9NR22 | 2/20 | 0.41 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19532293 | 0.81 | ACACB (0.45) | ACACBACACAPPARGPPARAKMT2A | |
| SCHEMBL3375902 | 0.77 | ACACB (0.49) | ACACBACACAKDM4EFFAR4 | |
| SCHEMBL10153872 | 0.77 | TDP1 (0.62) | ACACBACACAKMT2APARP10ALDH1A1 | |
| SCHEMBL197284 | 0.76 | ALDH1A3 (0.56) | ACACBACACAKMT2AMAP4K4PARP10 | |
| SCHEMBL761932 | 0.75 | KMT2A (0.48) | ACACBACACAKMT2AHPGD | |
| SCHEMBL8984342 | 0.75 | ALDH1A1 (0.67) | ACACBACACAKMT2APARP10MCL1 | |
| SCHEMBL15698784 | 0.75 | ACACB (0.45) | ACACBACACAPPARGPPARAKMT2A | |
| SCHEMBL1335756 | 0.75 | AKR1C3 (0.47) | ACACBACACAPPARGPPARAKMT2A | |
| SCHEMBL4198689 | 0.74 | LMNA (0.55) | ACACBACACAALDH1A1KDM4EHSD17B10 | |
| SCHEMBL2423300 | 0.74 | KMT2A (0.63) | ACACBACACAKMT2APARP10MCL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230272156-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-108884302-A | Heat-curing resin constituent, prepreg and their solidfied material | 日本化药株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108884212-A | Maleimide resin, hardening resin composition and its hardening thing | 日本化药株式会社 | 2018-11-23 | — | — | CN | disclosed |
| US-20170369636-A1 | Aromatic Amine Resin, Epoxy Resin Composition And Cured Product Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2017-12-28 | — | — | US | disclosed |
| EP-3248996-A1 | AROMATIC AMINE RESIN, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2017-11-29 | — | — | EP | disclosed |
| US-8703845-B2 | Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material | DIC CORPORATION (JP) | 2014-04-22 | — | — | US | disclosed |
| US-20130237639-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL | DIC CORPORATION (JP) | 2013-09-12 | — | — | US | disclosed |
| EP-2623535-A1 | CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL | DIC Corporation (JP) | 2013-08-07 | — | — | EP | disclosed |
| US-8263714-B2 | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20110275739-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-11-10 | — | — | US | disclosed |
| EP-1785441-B1 | EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN | DAINIPPON INK & CHEMICALS (JP) | 2011-06-08 | — | — | EP | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1785441-A1 | EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2007-05-16 | — | — | EP | disclosed |
| EP-0311387-B1 | AROMATIC AMINE RESINS, THEIR PRODUCTION PROCESS AND THERMOSETTING RESIN COMPOSITIONS MAKING USE OF THE SAME | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-08-11 | — | — | EP | disclosed |
| EP-0342943-B1 | THERMOSETTING RESIN COMPOSITION | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-08-04 | — | — | EP | disclosed |
| US-5145949-A | Production process for making aromatic amine resins | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-09-08 | — | — | US | disclosed |
| US-5106953-A | Reacting aromatic amines with bishalogenomethyl derivatives; curing agents or raw materials for polyamides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-04-21 | — | — | US | disclosed |
| US-5051494-A | A bismaleimide and an amino resin | MITSUI TOATSU CHEMICALS, INC. (JP) | 1991-09-24 | — | — | US | disclosed |
| US-4959443-A | HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-09-25 | — | — | US | disclosed |
| US-4937318-A | Aromatic amine resins | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-06-26 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20170369636-A1 | Aromatic Amine Resin, Epoxy Resin Composition And Cured Product Thereof | H1-5, ASH2L, ASH1L | ACACB 3738/4885ACACA 2723/4885PPARG 4206/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.