Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC9 | Q9UKV0 | 1/20 | 0.46 |
| ▸ | KDM1A | O60341 | 3/20 | 0.43 |
| ▸ | MAOB | P27338 | 1/20 | 0.43 |
| ▸ | SIGMAR1 | Q99720 | 4/20 | 0.39 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | TP53 | P04637 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | HTR2A | P28223 | 2/20 | 0.38 |
| ▸ | DRD2 | P14416 | 1/20 | 0.37 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.37 |
| ▸ | HTR2C | P28335 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | HTR2B | P41595 | 1/20 | 0.37 |
| ▸ | MTOR | P42345 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7130223 | 0.76 | KDM1A (0.50) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL6337745 | 0.75 | HDAC9 (0.49) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL5047677 | 0.72 | KDM1A (0.47) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL8849610 | 0.72 | SIGMAR1 (0.50) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL7619310 | 0.72 | KDM1A (0.47) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL19130584 | 0.72 | HDAC9 (0.50) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL5796055 | 0.72 | HDAC9 (0.50) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL15106028 | 0.72 | KDM1A (0.37) | KDM1AMAOBSIGMAR1TSHRTP53 | |
| SCHEMBL3832135 | 0.71 | KDM1A (0.46) | HDAC9KDM1AMAOBSIGMAR1TSHR | |
| SCHEMBL9464679 | 0.71 | KDM1A (0.46) | HDAC9KDM1AMAOBSIGMAR1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210009778-A1 | FLAME-RESISTANT FOAMED STYRENE-BASED RESIN COMPOSITION | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2021-01-14 | — | — | US | claimed |
| EP-3670585-A1 | FLAME-RESISTANT FOAMED STYRENE-BASED RESIN COMPOSITION | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2020-06-24 | — | — | EP | claimed |
| CN-111032755-A | Flame-retardant expandable styrene resin composition | 第一工业制药株式会社 | 2020-04-17 | — | — | CN | claimed |
| EP-2426165-B1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN COMPOSITION | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 2016-06-29 | — | — | EP | claimed |
| US-9187607-B2 | Flame-retarded foamable styrene-based resin compositions | DAI-ICHI KOGYO SEIYAKU, CO., LTD. (JP) | 2015-11-17 | — | — | US | claimed |
| EP-2426152-B1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 2014-06-04 | — | — | EP | claimed |
| EP-2426152-A1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2012-03-07 | — | — | EP | claimed |
| EP-2426165-A1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN COMPOSITION | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2012-03-07 | — | — | EP | claimed |
| CN-102356096-A | Flame-retardant expandable styrene resin particles and method for producing same | DAI ICHI KOGYO SEIYAKU CO LTD | 2012-02-15 | — | — | CN | claimed |
| CN-102356123-A | Flame-retardant expandable styrene resin composition | DAI ICHI KOGYO SEIYAKU CO LTD | 2012-02-15 | — | — | CN | claimed |
| US-20110319507-A1 | FLAME-RETARDED FOAMABLE STYRENE-BASED RESIN BEADS AND PROCESS FOR PRODUCING THE SAME | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2011-12-29 | — | — | US | claimed |
| US-11970612-B2 | Polyamide composition and molded product composed of said polyamide composition | KURARAY CO., LTD. (JP) | 2024-04-30 | — | — | US | disclosed |
| CN-115210340-B | Flame retardant composition for styrene resin foam, flame retardant styrene resin foam composition, and extrusion molded foam thereof | 第一工业制药株式会社 | 2024-04-05 | — | — | CN | disclosed |
| US-20240101807-A1 | FLAME RETARDANT COMPOSITION FOR FOAMED STYRENE RESIN, FLAME-RETARDANT FOAMED STYRENE-BASED RESIN COMPOSITION, AND EXTRUSION FOAM-MOLDED PRODUCT OF SAME | DKS CO. LTD. (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-112601788-B | Polyamide composition and molded article formed from the same | 株式会社可乐丽 | 2024-03-08 | — | — | CN | disclosed |
| US-20110319507-A1 | FLAME-RETARDED FOAMABLE STYRENE-BASED RESIN BEADS AND PROCESS FOR PRODUCING THE SAME | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2011-12-29 | — | — | US | disclosed |
| CN-101802049-A | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2010-08-11 | — | — | CN | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |
| US-20060106122-A1 | Extruded polystyrene resin foam board and process for preparing the same | JSP CORPORATION (JP) | 2006-05-18 | — | — | US | disclosed |