Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 4/20 | 0.62 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.62 |
| ▸ | CES2 | O00748 | 1/20 | 0.61 |
| ▸ | CES1 | P23141 | 1/20 | 0.61 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.57 |
| ▸ | NPC1 | O15118 | 6/20 | 0.54 |
| ▸ | RAB9A | P51151 | 6/20 | 0.54 |
| ▸ | PKM | P14618 | 4/20 | 0.54 |
| ▸ | CDK5 | Q00535 | 3/20 | 0.54 |
| ▸ | CDK5R1 | Q15078 | 3/20 | 0.54 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.53 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.53 |
| ▸ | POLB | P06746 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 3/20 | 0.51 |
| ▸ | MEN1 | O00255 | 1/20 | 0.50 |
| ▸ | TNF | P01375 | 1/20 | 0.50 |
| ▸ | KLF5 | Q13887 | 1/20 | 0.50 |
| ▸ | NOD1 | Q9Y239 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1348555 | 0.89 | NPC1 (0.54) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL10903675 | 0.83 | CYP1A2 (0.74) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL19795459 | 0.80 | KMT2A (0.52) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL19795426 | 0.80 | KMT2A (0.65) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL153153 | 0.80 | ALDH1A1 (0.56) | KMT2AALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL10779108 | 0.79 | MAPT (0.54) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL2157002 | 0.78 | CES2 (1.00) | KMT2AALDH1A1CES2CES1NPC1 | |
| SCHEMBL27806794 | 0.78 | AKR1C3 (0.49) | L3MBTL1NPC1RAB9APKMCDK5 | |
| SCHEMBL195165 | 0.77 | KMT2A (0.62) | KMT2AALDH1A1CES2CES1L3MBTL1 | |
| SCHEMBL20278523 | 0.77 | KMT2A (0.62) | KMT2AALDH1A1CES2CES1L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20150024326-A1 | PHOTOIMAGEABLE COMPOSITIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES | KAYAKU ADVANCED MATERIALS, INC. | 2015-01-22 | — | — | US | disclosed |
| US-20150024326-A1 | PHOTOIMAGEABLE COMPOSITIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES | KAYAKU ADVANCED MATERIALS, INC. | 2015-01-22 | — | — | US | disclosed |
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-7396898-B2 | Diamine, acid dianhydride, and reactive group containing polyimide composition prepared therefrom and process of preparing them | KANEKA CORPORATION (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20040235992-A1 | Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom | KANEKA CORPORATION (JP) | 2004-11-25 | — | — | US | disclosed |
| EP-0814109-B1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL CO LTD (JP) | 2004-08-18 | — | — | EP | disclosed |
| US-20040158030-A1 | Diamine, acid dianhydride, polymide composition having reactive group obtained therefrom, and processes for producing these | KANEKA CORPORATION (JP) | 2004-08-12 | — | — | US | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20020048726-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-6319656-B1 | FORMING FILM OF A NEGATIVE-WORKING PHOTO-SENSITIVE POLYIMIDE PRECURSOR ON A SUBSTRATE; EXPOSING FILM TO LIGHT THROUGH A MASK HAVING A PREDETERMINED PATTERN; DEVELOPING THE EXPOSED FILM USING AN ALKALINE AQUEOUS SOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6087006-A | SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6025113-A | FOR PREPARING HIGHLY SENSITIVE NEGATIVE-WORKING PHOTOSENSITIVE MATERIAL DEVELOPABLE WITH ALKALINE AQUEOUS SOLUTION IN SHORT TIME WITH HIGH RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0814109-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-12-29 | — | — | EP | disclosed |